The shear strength and fracture behavior of Sn-Ag-xSb solder joints with Au/Ni-P/Cu UBM

Journal of Electronic Materials

Volumn 37, Issue 6, 2008, Pages 867-873

  Lee, Hwa Teng ^a   Hu, Shuen Yuan ^a   Hong, Ting Fu ^a   Chen, Yin Fa ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Failure mode; Intermetallic compounds; Lead free solders; Thermal storage; Underbump metallization

Indexed keywords

FAILURE MODE; LEAD-FREE SOLDERS; THERMAL STORAGE; UNDERBUMP METALLIZATION;

FRACTURE; HEAT RESISTANCE; INTERMETALLICS; ISOTHERMS; METALLIZING; MICROSTRUCTURE; SHEAR STRENGTH; SUBSTRATES;

SOLDERED JOINTS;

EID: 42449131369     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0396-5     Document Type: Article

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