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Journal of Applied Physics

Volumn 104, Issue 3, 2008, Pages

Experimental evaluation of wetting dynamics models for Sn63 Pb37 and SnAg4.0 Cu0.5 solder materials

(3) Kim, Chunho a Kang, Suk Chae b Baldwin, Daniel F c

a INTEL CORPORATION (United States)

b SAMSUNG Electronics (South Korea)

c GEORGIA INSTITUTE OF TECHNOLOGY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CHEMICAL REACTIONS; CONTACT ANGLE; DYNAMICS; EUTECTICS; FORCED CONVECTION; KINETIC THEORY; LEAD; NEWTONIAN FLOW; SEMICONDUCTOR DOPING; SOLDERED JOINTS; SOLDERING; SPEED; SURFACE CHEMISTRY; SURFACE TENSION; VISCOUS FLOW; WELDING;

CHEMICAL-; CONTACT ANGLES; ELECTRONICS MANUFACTURING; EQUILIBRIUM ANGLES; EQUILIBRIUM CONTACT ANGLE; EUTECTIC SOLDERING; EXPERIMENTAL EVALUATIONS; EXPERIMENTAL MEASUREMENTS; KINETIC MODELLING; LEAD-FREE SOLDER; LEAD-FREE SOLDER MATERIALS; LOW SPEED; NON LINEARITIES; SOLDER BALLS; SOLDER WETTING; SUBSTRATE SURFACE FINISH; TEMPERATURE DEPENDENCES; VISCOUS DISSIPATION; WETTING ANGLES; WETTING DYNAMICS; WETTING SPEED;

WETTING;

EID: 49749145316 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.2964118 Document Type: Article

Times cited : (18)

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