Interfacial fracture toughness of Pb-free solders

Microelectronics Reliability

Volumn 49, Issue 3, 2009, Pages 269-287

  Hayes, S M ^a,b   Chawla, N ^b   Frear, D R ^a  

^a Advanced Packaging and Systems Integration   (United States)

^b Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BEARINGS (STRUCTURAL); BRAZING; CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; ENVIRONMENTAL REGULATIONS; FAILURE ANALYSIS; FRACTURE; FRACTURE TOUGHNESS; LEAD; LEAD ALLOYS; MECHANICAL PROPERTIES; MICROELECTRONICS; NICKEL; PALLADIUM; RELIABILITY ANALYSIS; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; SUBSTRATES; WELDING;

ADVERSE EFFECTS; BULK SOLDERS; COMPACT TENSION SPECIMENS; CU SUBSTRATES; ELECTRONIC PACKAGES; ENVIRONMENTAL CONCERNS; FRACTURE BEHAVIORS; GOVERNMENT REGULATIONS; INTERFACIAL DELAMINATIONS; INTERFACIAL FRACTURE TOUGHNESS; INTERFACIAL INTERMETALLICS; INTERGRANULAR; INTERMETALLIC COMPOUND GROWTHS; INTERMETALLIC COMPOUNDS; INTERMETALLIC THICKNESS; LIQUIDUS; METALLIZATION; MICROELECTRONICS INDUSTRIES; PB-FREE; PB-FREE SOLDERS; SOLDER JOINTS; THERMO MECHANICALS;

TIN;

EID: 61349127145     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.11.004     Document Type: Article

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