Creep behaviour of lead free and lead containing solder materials at high homologous temperatures with regard to small solder volumes

Sensors and Actuators, A: Physical

Volumn 99, Issue 1-2, 2002, Pages 194-197

  Villain, J ^a,c   Brueller, O S ^b   Qasim, T ^a  

^a AUGSBURG UNIVERSITY OF APPLIED SCIENCES   (Germany)

^b TECHNICAL UNIVERSITY OF MUNICH   (Germany)

^c Tel: +49 821 5586 386 ^*  (Germany)

Author keywords

Creep; High homologous temperatures; Size effect; Solder

Indexed keywords

LEAD FREE SOLDERS;

CREEP; LEAD ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL EFFECTS;

MICROELECTRONICS;

EID: 0037197326     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00882-2     Document Type: Conference Paper

References (4)

1. Comparison of the creep behaviour of lead-containing (60Sn-40Pb) and a lead-free solder alloy (96.5Sn-3.5Ag) at high homologous temperatures