Reliability of lead-free SnAg solder bumps: Influence of electromigration and temperature

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1407-1415

  Ebersberger, Bernd ^a   Bauer, Robert ^a   Alexa, Lars ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; DEGRADATION; ELECTROMIGRATION; HIGH TEMPERATURE OPERATIONS; LEAD ALLOYS; METALLIZING; RELIABILITY; TIN ALLOYS;

BUMP LIFETIME; HIGH TEMPERATURE STORAGE (HTS); LIFETIME; UNDER BUMP METALLIZATION (UBM); VOID FORMATION;

SOLDERING ALLOYS;

EID: 24644488440     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Brandenburg S., Yeh S., "Electromigration study of flip chip bump solder joint", Surface Mount International Conference & Exposition, p. 337 (1998).
2. E. J. Vardaman, L. Matthew, "Flip Chip and Wafer Level Packaging Trends and Market Forecasts", TechSearch International, Nov. 2004.
3. Wu J. D., Zheng P. J., Lee C.W., Hung S.C., Lee J.J., "A Study in Flip-Chip UBM/Bump Reliability with Effects of SnPb Solder Composition", 2003 IEEE International Reliability Physics Symposium Proceedings, 41st Annual, Dallas, Texas, p. 132.
4. th Electronic Components and Technology Conf, Las Vegas, NV, June 2004, pp. 683-691.
5. Rinne G., "Issues in accelerated electromigration of solder bumps", Microelectronics Reliability 43 (2003), pp. 1975-1980.
6. th Electronic Components and Technology Conf., Las Vegas, NV, June 2004, pp. 983-987.