Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages

Microelectronics Reliability

Volumn 47, Issue 2-3, 2007, Pages 259-265

  Vandevelde, Bart ^a   Gonzalez, Mario ^a   Limaye, Paresh ^a   Ratchev, Petar ^a   Beyne, Eric ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CREEP; ENERGY DISSIPATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; HYSTERESIS; INTEGRATED CIRCUIT LAYOUT; RELIABILITY THEORY; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL CYCLING;

CREEP STRAIN RATE; INELASTIC STRAINS; QFN PACKAGES; UNDERFILLED FLIP CHIPS;

ELECTRONICS PACKAGING;

EID: 33846627794     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.09.034     Document Type: Article

References (11)

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9. Vandevelde B, Beyne E, Zhang GQ, Caers J, Solder parameter sensitivity for CSP life-time prediction using simulation-based optimisation method. In: Proceedings of the 51st electronic components and technology conference, Lake Buena Vista, Florida, USA; 29 May -1 June 2001. p. 281-7.
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