Interfacial reactions of BGA Sn-3.5%Ag-0.5%Cu and Sn-3.5%Ag solders during high-temperature aging with Ni/Au metallization

Materials Science and Engineering: B

Volumn 113, Issue 3, 2004, Pages 184-189

  Sharif, Ahmed ^a   Islam, M N ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Au Ni Cu substrate; Intermetallic compounds; Ni consumption; Sn based lead free solder

Indexed keywords

AGING OF MATERIALS; ENERGY DISPERSIVE SPECTROSCOPY; GOLD; HIGH TEMPERATURE EFFECTS; INTERMETALLICS; METALLIZING; NICKEL; SCANNING ELECTRON MICROSCOPY; SURFACE REACTIONS; TIN ALLOYS;

NICKEL CONSUMPTION; SN-BASED LEAD FREE SOLDERS; SOLID-STATE AGING; TERNARY COMPOUNDS;

SOLDERING ALLOYS;

EID: 6344292282     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5107(04)00406-4     Document Type: Article

References (17)

1. Y.C. Chan, A.C.K. So, J.K.L. Lai, Mat. Sci. Eng. B 55 (1998) 5.
2. A.C.K. So, Y.C. Chan, J.K.L. Lai, IEEE Trans. CMPT, Part B 20 (1997) 463.
3. P.L. Tu, Y.C. Chan, K.C. Hung, J.K.L. Lai, Scripta Materialia 44 (2001) 317.
4. P. Kay, C.A. McKay, Trans. Inst. Met. Fin. 57 (1997) 169.
5. S.K. Kang, W.K. Choi, D.Y. Shih, P. Lauro, D.W. Henderson, T. Gosselin, D.N. Leonard, Proceedings of the 52nd Electronic Components and Technology Conference, 2002, p. 146.
6. P.O. Kim, J.W. Jang, T.Y. Lee, K.N. Tu, J. Appl. Physics 86 (1999) 6746.
7. K.N. Tu, K. Zeng, Mater. Sci. Eng. R 34 (2001) 1.
8. C.M. Miller, I.E. Anderson, J.F. Smith, J. Electron; Mater. 23 (1994) 595.
9. K.Y. Lee, M. Li, D.R. Olsen, W.T. Chen, T.C. Ben, S. Mhaisalkar, Proceedings of the 51st Electronic Components and Technology Conference, 2001, p. 478.
10. M.N. Islam, Y.C. Chan, A. Sharif, M.O. Alam, J. Microelectron. Reliability 43 (2003) 2031.
11. F. Zhang, M. Li, C.C. Chum, K.N. Tu, J. Mater. Res. 17 (2002) 2757.
12. S.W. Chen, C.M. Chen, W.C. Liu, J. Electron. Mater. 27 (1998) 1193.
13. T.M. Korhonen, P. Su, S.J. Hong, M.A. Korhonen, Y.C. Li, J. Electron. Mater. 29 (2000) 1194.
14. S. Bader, W. Gust, H. Hieben Acta Metall. Mater. 43 (1995) 329.
15. K. Kulojarvi, V. Vuorinen, J. Kivilahti, Microelectron. Int. 15 (1998) 20.
16. H.G. Song, J.P. Ahn, A.M. Minor, J.W. Morris Jr., J. Electron. Mater. 30 (2001) 409.
17. D.R. Flanders, E.G. Jacobs, R.F. Pinizzotto, J. Electron. Mater. 26 (1997) 883.