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Volumn 21, Issue 6, 2008, Pages 82-85

Mechanical properties of fine pitch devices soldered joints based on creep model

Author keywords

Creep properties; Finite element method; Fracture microstructure; Tensile strength

Indexed keywords

BRAZING; CREEP; ELECTRONIC EQUIPMENT MANUFACTURE; FINITE ELEMENT METHOD; FRACTURE; FRACTURE TOUGHNESS; LEAD; MECHANICAL PROPERTIES; MECHANISMS; MICROSTRUCTURE; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; SILVER; SOLDERED JOINTS; STRENGTH OF MATERIALS; STRESSES; TENSILE STRENGTH; THEOREM PROVING; THERMAL CYCLING;

EID: 58149305399     PISSN: 10009345     EISSN: None     Source Type: Journal    
DOI: 10.3901/CJME.2008.06.082     Document Type: Article
Times cited : (29)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.