|
|
Volumn 54, Issue 6, 2002, Pages 34-37
|
|
Electromigration in solder joints and solder lines
a,b
a,b
a,b
a,b
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
CURRENT DENSITY;
DIFFUSION;
ELECTROMIGRATION;
ELECTRON TRANSPORT PROPERTIES;
EUTECTICS;
FLIP CHIP DEVICES;
RELIABILITY;
SEMICONDUCTING SILICON;
TIN ALLOYS;
FLIP CHIP SOLDER JOINTS;
LEAD FREE SOLDER ALLOYS;
SOLDER LINES;
SOLDERED JOINTS;
|
|
EID: 0036612340
PISSN: 10474838
EISSN: None
Source Type: Journal
DOI: 10.1007/BF02701847 Document Type: Article |
|
Times cited : (74)
|
|
References (16)
|
