Effect of electromigration on interfacial reactions between electroless Ni-P and Sn-3.5% Ag solder

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 413-418

  Kumar, A ^a   He, M ^a   Chen, Z ^a   Teo, P S ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Electroless Ni P; Electromigration; Interfacial reactions; Solder

Indexed keywords

ATOMIC DISTRIBUTION; ELECTROMIGRATION FLUX; MASS FLUX;

ANNEALING; CATHODES; DIFFUSION; ELECTROMIGRATION; INTERFACES (MATERIALS); INTERMETALLICS;

SOLDERING ALLOYS;

EID: 4344593985     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.042     Document Type: Article

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