Influence of Sb on IMC growth in Sn-Ag-Cu-Sb Pb-free solder joints in reflow process

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 395-401

  Chen, B L ^a   Li, G Y ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Intermetallic growth; Lead free solder; Ripening; Sb addition

Indexed keywords

NUCLEATION EFFECTS; REFLOW PROCESS; RIPENING;

ANTIMONY; ENERGY DISPERSIVE SPECTROSCOPY; INTERMETALLICS; LEAD; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; X RAY DIFFRACTION ANALYSIS;

TIN;

EID: 4344605852     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.063     Document Type: Article

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