Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 17, Issue 4, 2007, Pages 805-810

  ZHAO, Xiao yan ^a   ZHAO, Mai qun ^a   CUI, Xiao qing ^a   TONG, Ming xin ^a  

^a XI'AN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

lead free solder alloy; mechanical property; melting point; Sn Ag Cu system; spreading property

Indexed keywords

CERIUM; ELONGATION; ENERGY DISPERSIVE X RAY ANALYSIS; MELTING POINT; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; TEMPERATURE MEASUREMENT;

LEAD FREE SOLDER ALLOY; SPREADING PROPERTY;

MICROSTRUCTURE;

EID: 34548715150     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(07)60178-2     Document Type: Article

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