Using microwave-assisted powder metallurgy route and nano-size reinforcements to develop high-strength solder composites

Journal of Materials Engineering and Performance

Volumn 19, Issue 3, 2010, Pages 335-341

  Nai, S M L ^a   Kuma, J V M ^a   Alam, M E ^a   Zhong, X L ^a   Babaghorbani, P ^a   Gupta, M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Lead free solder; Metal matrix nanocomposite; Microwave sintering; Tensile properties

Indexed keywords

LEAD FREE SOLDERS; LEAD-FREE SOLDER; MATRIX; MICROWAVE SINTERING;

ALUMINUM POWDER METALLURGY; BUILDING MATERIALS; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; INTERMETALLICS; LEAD; LEAD OXIDE; MECHANICAL PROPERTIES; METALLIC MATRIX COMPOSITES; METALLURGY; MICROWAVE HEATING; MICROWAVES; NANOCOMPOSITES; POWDER METALS; SILVER; SINTERING; SOLDERING ALLOYS; TENSILE STRENGTH; TITANIUM COMPOUNDS;

TIN;

EID: 77952097165     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11665-009-9481-z     Document Type: Article

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