Effects of in situ nickel particle addition on the microstructure and microhardness of Sn-Ag solder

Science and Technology of Welding and Joining

Volumn 10, Issue 3, 2005, Pages 353-360

  Lee, H T ^a   Lee, Y H ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Microhardness; Microstructure; Ni particles; Sn Ag Ni composite solder

Indexed keywords

EID: 33644969661     PISSN: 13621718     EISSN: 13621718     Source Type: Journal    
DOI: 10.1179/174329305X40697     Document Type: Article

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