Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

Journal of Electronic Materials

Volumn 31, Issue 5, 2002, Pages 456-465

  Kanchanomai, Chaosuan ^a   Miyashita, Yukio ^a   Mutoh, Yoshiharu ^a  

^a NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

Crack initiation; Crack propagation; Ductility modifie d Coffin Manson's relationship; Lead free solder; Low cycle fatigue; Sn 3.5Ag; Sn 3Ag 0.5Cu; Sn 3Ag 0.5Cu 1Bi; Sn 3Ag 0.5Cu 3Bi

Indexed keywords

CRACK INITIATION; CRACK PROPAGATION; DUCTILE FRACTURE; DUCTILITY; EUTECTICS; FATIGUE OF MATERIALS; FATIGUE TESTING; GRAIN BOUNDARIES; MICROCRACKS; PHASE COMPOSITION; SOLDERING ALLOYS; STRAIN; THERMAL EFFECTS;

LOW-CYCLE FATIGUE (LCF);

TIN ALLOYS;

EID: 0036575439     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0100-0     Document Type: Article

References (18)

1. Adv. electronic packaging
2. ASTM E606: Standard practice for strain-controlled fatigue testing
3. ASTM E1351-96: Standard practice for production and evaluation of field metallographic replicas