Creep deformation of lead-free Sn-3.5 Ag-Bi solders

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 42, Issue 3, 2003, Pages 1368-1374

  Shin, Seung Woo ^a   Yu, Jin ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Brittle; Cavity; Lead free; Solder; Strain rate; Ternary alloy

Indexed keywords

CREEP; DUCTILITY; FRACTOGRAPHY; GRAIN BOUNDARIES; LEAD; ROLLING; STRAIN RATE; TERNARY SYSTEMS; TIN ALLOYS;

LEAD FREE SOLDERS;

SOLDERING ALLOYS;

EID: 0038629390     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.42.1368     Document Type: Article

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