Kinetics of intermetallic compound layer growth and interfacial reactions between Sn-8Zn-5In solder and bare copper substrate

Materials Science and Technology

Volumn 21, Issue 3, 2005, Pages 381-385

  Kim, D G ^a   Jang, H S ^a   Jung, S B ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Activation energy; Interfacial reaction; Intermetallic compounds; Sn Zn In solder

Indexed keywords

ACTIVATION ENERGY; GROWTH (MATERIALS); INDIUM; REACTION KINETICS; SOLDERING ALLOYS; SURFACE CHEMISTRY; TIN; ZINC;

INTERFACIAL REACTIONS; LAYER GROWTH; MELTING TEMPERATURE; SN-ZN-IN SOLDERS;

INTERMETALLICS;

EID: 18844411142     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/174328405X27061     Document Type: Article

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