Experimental and finite element method studies of j-lead solder joint reliability

Journal of Materials Science and Technology

Volumn 21, Issue 3, 2005, Pages 419-422

  Chen, Hongtao ^a,b   Wang, Chunqing ^a   Li, Mingyu ^a   Tian, Yanhong ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b JIAMUSI UNIVERSITY   (China)

Author keywords

Finite element method (FEM); Reliability; Sn63 Pb37; Solder joint

Indexed keywords

COMPUTER SIMULATION; CRACK INITIATION; CRACK PROPAGATION; FINITE ELEMENT METHOD; INTERMETALLICS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; STRAIN; STRESSES; THERMAL CYCLING;

GRAIN COARSENING; PLASTIC LEADED CHIP CARRIER (PLCC); THERMAL FATIGUE CRACKS;

SOLDERED JOINTS;

EID: 20544469011     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

1. H.D.Solomon: IEEE T. Compon., Hybr., 1989, (12), 473.
2. G.Grossmann: IEEE T. Electron. Pack. M., 1999, (22), 71.
3. C.G.Schimidt, J.W.Simons, C.H.Kazanawa and D.C.Erlich: IEEE T. Compon., Pack M. T., 1995, (18), 611.
4. J.H.L.Pang, K.H.Tan, Xunqing Shi and Z.P.Wang: IEEE T. Compon. and Pack. T., 2001, (24), 10.
5. B.Vandevelde, E.Beyne, G.Q.Zhang and J.Caers: in Proc. Electron. Compon. Technol. Conference, Orlando, FL, 2001, 281.
6. C.K.Yeo, S.Mhaisalkar, H.L.J.Pang: in Proc. Electron. Compon. Technol. Conference, Orlando, FL, 1996, 1222.
7. B.Z.Hong and T.D.Yuan: in Proc. InterSociety Conference Thermal Thermomechanical Phenomena Electron. Systems, Seattle, WA, 1998, 220.
8. J.H.Lau, S-W.R.Lee: in Proc. Int. Symp. Electron. Mater. Pack., Hong Kong, China, 2000, 55.
9. O.K.So and Y.C.Chan: IEEE T. Compon., Pack. B, 1996, 19, 661.
10. R.E.Pratt, E.I.Stromswold and D.J.Quesnel: IEEE T. Compon., Pack. A, 1996, 19, 134.
11. P.L.Tu, Y.C.Chan and J.K.L.Lai: IEEE T. Compon., Pack. B, 1997, 20, 87.
12. K.Kishimoto, M.Omiya and M.Amagai: in Proc. Int. Symp. on Electron. Mater. Pack., Jeju Island, South Korea, 2001, 8.