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Volumn 1, Issue , 2015, Pages

Integrating MEMS and ICs

Author keywords

Cofabrication platforms; Integrated circuits (ICs); Microelectromechanical system (MEMS); More Than Moore; Multi chip modules (MCMs); System in package (SiP); System on chip (SoC); Three dimensional (3D) heterogeneous integration

Indexed keywords


EID: 85045082677     PISSN: None     EISSN: 20557434     Source Type: Journal    
DOI: 10.1038/micronano.2015.5     Document Type: Review
Times cited : (278)

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