Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays

Infrared Physics and Technology

Volumn 60, Issue , 2013, Pages 251-259

  Forsberg, Fredrik ^a   Roxhed, Niclas ^a   Fischer, Andreas C ^a   Samel, Björn ^b   Ericsson, Per ^b   Hoivik, Nils ^c   Lapadatu, Adriana ^c   Bring, Martin ^c   Kittilsland, Gjermund ^c   Stemme, Göran ^a   Niklaus, Frank ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b ACREO AB   (Sweden)

^c Sensonor AS   (Norway)

Author keywords

Bolometer; IR; MEMS; Thermal imaging; Very large scale heterogeneous integration

Indexed keywords

AUTOMOTIVE APPLICATIONS; COST-SENSITIVE APPLICATIONS; FABRICATION AND CHARACTERIZATIONS; HETEROGENEOUS INTEGRATION; LONG-WAVELENGTH INFRARED RANGES; NONCONTACT MEASUREMENTS; TEMPERATURE COEFFICIENT OF RESISTANCE; WAFER LEVEL VACUUM PACKAGING;

BOLOMETERS; CMOS INTEGRATED CIRCUITS; COST REDUCTION; INFRARED DETECTORS; INFRARED IMAGING; INFRARED RADIATION; INTEGRATION; IRIDIUM; MEMS; SEMICONDUCTOR QUANTUM WELLS; SILICON ALLOYS; TECHNOLOGY; VACUUM; WAFER BONDING;

ELECTRONICS PACKAGING;

EID: 84879956633     PISSN: 13504495     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.infrared.2013.05.006     Document Type: Article

References (45)

1. H. Kaplan third ed. Practical Applications of Infrared Thermal Sensing and Imaging Equipment, SPIE Tutorial Texts in Optical Engineering vol. TT75 2007 SPIE Publications < http://www.worldcat.org/isbn/0819467235 >
2. S.A. Merryman, and R.M. Nelms Diagnostic technique for power systems utilizing infrared thermal imaging IEEE Transactions on Industrial Electronics 42 6 1995 615 628 < http://dx.doi.org/10.1109/41.475502 >
3. M.A. Omar, Y. Zhou, J. Liu, Automated applications of the infrared imagers in the automotive assembly lines: products and process control, in: Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 6541, 2007. < http://dx.doi.org/10.1117/12.718013 >.
4. M.S. Alam, and A. Bal Improved multiple target tracking via global motion compensation and optoelectronic correlation IEEE Transactions on Industrial Electronics 54 1 2007 522 529 < http://dx.doi.org/10.1109/TIE.2006.885513 > (Pubitemid 46444049)
5. T. Kvisterøy, H. Jakobsen, C. Vieider, S. Wissmar, P. Ericsson, U. Halldin, F. Niklaus, F. Forsberg, G. Stemme, J.E. Källhammer, H. Pettersson, D. Eriksson, J. Franks, J. VanNylen, H. Vercammen, A. VanHulsel, Far infrared low-cost uncooled bolometer for automotive use, in: Advanced Microsystems for Automotive Applications, 2007.
6. C. Vieider, S. Wissmar, P. Ericsson, U. Halldin, F. Niklaus, G. Stemme, J.E. Källhammer, H. Pettersson, D. Eriksson, H. Jakobsen, T. Kvisterøy, J. Franks, J. VanNylen, H. Vercammen, A. VanHulsel, Low-cost far infrared bolometer camera for automotive use, in: Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 6542, 2007. < http://dx.doi.org/10.1117/12.721272 >.
7. M. Kohin, N.R. Butler, Performance limits of uncooled VOx microbolometer focal plane arrays, in: B.F. Andresen, G.F. Fulop (Eds.), Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 5406, 2004, pp. 447-453. < http://dx.doi.org/10.1117/12.542482 >.
8. C. Li, G.D. Skidmore, C. Howard, C.J. Han, L. Wood, D. Peysha, E. Williams, C. Trujillo, J. Emmett, G. Robas, D. Jardine, C.F. Wan, E. Clarke, Recent development of ultra small pixel uncooled focal plane arrays at DRS, in: Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 6542, 2007. < http://dx.doi.org/10.1117/12.720267 >.
9. C. Trouilleau, B. Fieque, J.L. Tissot, P. Robert, A. Crastes, C. Minassian, O. Legras, B. Dupont, A. Touvignon, S. Tinnes, J.J. Yon, A. Arnaud, Uncooled amorphous silicon 160 × 120 irfpa with 25-μm pixel-pitch for large volume applications, in: Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 6542, 2007. < http://dx.doi.org/10. 1117/12.723599 >.
10. D. Murphy, M. Ray, J. Wyles, C. Hewitt, R. Wyles, E. Gordon, K. Almada, T. Sessler, S. Baur, D.V. Lue, S. Black, 640 × 512 17 μm microbolometer fpa and sensor development, in: Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 6542, 2007. < http://dx.doi.org/10. 1117/12.724345 >.
11. R.J. Blackwell, T. Bach, D. O'Donnell, J. Geneczko, M. Joswick, 17 μm pixel 640 × 480 microbolometer fpa development at bae systems, in: Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 6542, 2007. < http://dx.doi.org/10.1117/12.723474 >.
12. F. Niklaus, C. Vieider, H. Jakobsen, MEMS-based uncooled infrared bolometer arrays - a review, in: MEMS/MOEMS Technologies and Applications III, vol. 6836, 2007, pp. 0D1-0D15.
13. Infrared Market Research Report. Volume IRW-C: The World Market for Commercial and Dual-Use Infrared Imaging and Infrared Thermometry Equipment, Maxtech International Inc., 2010.
14. S.H. Black, R. Kraft, A. Medrano, T. Kocian, D. Bradstreet, R. Williams, T. Yang, Advances in high-rate uncooled detector fabrication at Raytheon, in: Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 7660, The International Society for Optical Engineering, 2010, pp. 76600X-76600X-12. < http://dx.doi.org/10.1117/12.853675 >.
15. P.W. Kruse, Can the 300-K radiating background noise limit be attained by uncooled thermal imagers? in: B.F. Andresen, G.F. Fulop (Eds.), Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 5406, 2004, pp. 437-446. < http://dx.doi.org/10.1117/12.539388 >.
16. C.M. Hanson, S.K. Ajmera, J. Brady, T. Fagan, W. McCardel, D. Morgan, T. Schimert, A.J. Syllaios, M.F. Taylor, Small pixel a-Si/a-SiGe bolometer focal plane array technology at L-3 communications, in: Infrared Technology and Applications XXXVI, vol. 7660, 2010, pp. 76600R+.
17. M. Mansi, M. Brookfield, S. Porter, I. Edwards, B. Bold, J. Shannon, P. Lambkin, A. Mathewson, AUTHENTIC: a very low cost infrared detector and camera system, in: Infrared Technology and Applications XXVIII, vol. 4820, 2003, pp. 227-238.
18. A. Tanaka, S. Matsumoto, N. Tsukamoto, S. Itoh, K. Chiba, T. Endoh, A. Nakazato, K. Okuyama, Y. Kumazawa, M. Hijikawa, H. Gotoh, T. Tanaka, and N. Teranishi Infrared focal plane array incorporating silicon IC process compatible bolometer IEEE Transactions on Electron Devices 43 11 1996 1844 1850 < http://dx.doi.org/10.1109/16.543017 >
19. V. Leonov, N. Perova, P. De Moor, B. Du Bois, C. Goessens, B. Grietens, A. Verbist, C. Van Hoof, J. Vermeiren, Micromachined poly-SiGe bolometer arrays for infrared imaging and spectroscopy, in: MEMS/MOEMS: Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly, vol. 4945, 2003, pp. 54-63.
20. E. Iborra, M. Clement, L.V. Herrero, and J. Sangrador IR uncooled bolometers based on amorphous GexSi1-xOy on silicon micromachined structures Journal of Microelectromechanical Systems 11 4 2002 322 329 < http://dx.doi.org/10.1109/ JMEMS.2002.800926 > (Pubitemid 34950039)
21. I. Ishikawa, M. Ueno, K. Endo, Y. Nakaki, H. Hata, T. Sone, and M. Kimata Low-cost 320 × 240 uncooled IRFPA using conventional silicon IC process Opto-Electronics Review 7 4 1999 297 303
22. D. Takamuro, T. Maegawa, T. Sugino, Y. Kosasayama, T. Ohnakado, H. Hata, M. Ueno, H. Fukumoto, K. Ishida, H. Katayama, T. Imai, M. Ueno, Development of new soi diode structure for beyond 17 μm pixel pitch soi diode uncooled irfpas, in: Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 8012, 2011. < http://dx.doi.org/10.1117/12.884556 >.
23. I. Fujiwara, K. Sasaki, K. Suzuki, H. Yagi, H. Kwon, H. Honda, K. Ishii, M. Ogata, M. Atsuta, R. Ueno, M. Kobayashi, H. Funaki, Scale down of p-n junction diodes of an uncooled ir-fpa for improvement of the sensitivity and thermal time response by 0.13-μm cmos technology, in: Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 8012, 2011. < http://dx.doi.org/10.1117/12.883342 >.
24. E. Socher, S.M. Beer, and Y. Nemirovsky Temperature sensitivity of SOI-CMOS transistors for use in uncooled thermal sensing IEEE Transactions on Electron Devices 52 12 2005 2784 2790 < http://dx.doi.org/10.1109/TED.2005. 859664 > (Pubitemid 41829464)
25. M. Esashi Wafer level packaging of MEMS Journal of Micromechanics and Microengineering 18 7 2008 073001+ < http://dx.doi.org/10.1088/0960-1317/18/ 7/073001 >
26. F. Zimmer, M. Lapisa, T. Bakke, M. Bring, G. Stemme, and F. Niklaus One-megapixel monocrystalline-silicon micromirror array on CMOS driving electronics manufactured with very large-scale heterogeneous integration Journal of Microelectromechanical Systems 20 3 2011 564 572 < http://dx.doi.org/10. 1109/JMEMS.2011.2127454 >
27. F. Niklaus, G. Stemme, Lu, and R.J. Gutmann Adhesive wafer bonding Journal of Applied Physics 99 3 2006 031101 031101-28 < http://dx.doi.org/10. 1063/1.2168512 >
28. F. Niklaus, A. Decharat, F. Forsberg, N. Roxhed, M. Lapisa, M. Populin, F. Zimmer, J. Lemm, and G. Stemme Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs Sensors and Actuators A: Physical 154 1 2009 180 186 < http://dx.doi.org/10.1016/j.sna.2009.07.009 >
29. M. Lapisa, G. Stemme, and F. Niklaus Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS IEEE Journal of Selected Topics in Quantum Electronics 17 3 2011 629 644 < http://dx.doi.org/10.1109/JSTQE.2010.2093570 >
30. F. Niklaus, E. Kaelvesten, G. Stemme, New concept for CMOS-compatible fabrication of uncooled infrared focal plane arrays using wafer-scale device transfer bonding, in: B.F. Andresen, G.F. Fulop, M. Strojnik (Eds.), Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 4369, 2001, pp. 397-404. < http://adsabs.harvard.edu/cgi-bin/nph-bib-query?bibcode= 2001SPIE.4369.397N >.
31. F. Niklaus, E. Kälvesten, and G. Stemme Wafer-level membrane transfer bonding of polycrystalline silicon bolometers for use in infrared focal plane arrays Journal of Micromechanics and Microengineering 11 5 2001 509+ < http://dx.doi.org/10.1088/0960-1317/11/5/310 >
32. F. Niklaus, J. Pejnefors, M. Dainese, M. Haggblad, P.E. Hellstrom, U.J. Wallgren, G. Stemme, Characterization of transfer-bonded silicon bolometer arrays, in: B.F. Andresen, G.F. Fulop (Eds.), Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 5406, 2004, pp. 521-530. < http://dx.doi.org/10.1117/12.565894 >.
33. F. Forsberg, N. Roxhed, P. Ericsson, S. Wissmar, F. Niklaus, G. Stemme, High-performance quantum-well silicon-germanium bolometers using IC-compatible integration for low-cost infrared imagers, in: Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International, IEEE, 2009, pp. 2214-2217. < http://dx.doi.org/10.1109/SENSOR.2009.5285617 >.
34. S. Wissmar, L. Höglund, J. Andersson, C. Vieider, S. Savage, P. Ericsson, High signal-to-noise ratio quantum well bolometer materials, in: Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 6401, The International Society for Optical Engineering, 2006, pp. 64010N-64010N-11. < http://dx.doi.org/10.1117/12.689874 >.
35. F. Niklaus, A. Decharat, C. Jansson, and G. Stemme Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure Infrared Physics & Technology 51 3 2008 168 177 URL http://dx.doi.org/10.1016/j.infrared.2007.08.001
36. F. Niklaus, C. Jansson, A. Decharat, J.E. Källhammer, H. Pettersson, G. Stemme, Uncooled infrared bolometer arrays operating in a low to medium vacuum atmosphere: performance model and tradeoffs, in: Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 6542, 2007. < http://dx.doi.org/10.1117/12.719163 >.
37. A. Lapadatu, G. Kittilsland, A. Elfving, E. Hohler, T. Kvisterøy, T. Bakke, P. Ericsson, High-performance long wave infrared bolometer fabricated by wafer bonding, in: Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, vol. 7660, 2010. < http://dx.doi.org/10.1117/12.852526 >.
38. K.C. Liddiard Application of interferometric enhancement to self-absorbing thin film thermal IR detectors Infrared Physics 34 4 1993 379 387 < http://dx.doi.org/10.1016/0020-0891(93)90070-N >
39. X. Gu, G. Karunasiri, G. Chen, U. Sridhar, and B. Xu Determination of thermal parameters of microbolometers using a single electrical measurement Applied Physics Letters 72 15 1998 1881 1883 < http://dx.doi.org/10.1063/1. 121214 > (Pubitemid 128671491)
40. F.N. Hooge 1/f noise sources IEEE Transactions on Electron Devices 41 11 1994 1926 1935 < http://dx.doi.org/10.1109/16.333808 >
41. P. Eriksson, J.Y. Andersson, and G. Stemme Thermal characterization of surface-micromachined silicon nitride membranes for thermal infrared detectors Journal of Microelectromechanical Systems 6 1 1997 55 61 < http://dx.doi.org/10.1109/84.557531 > (Pubitemid 127627422)
42. T.B. Massalski, Binary Alloy Phase Diagrams, 2nd ed., Asm Intl, 1990. < http://www.worldcat.org/isbn/087170403X >.
43. N. Hoivik, K. Wang, K. Aasmundtveit, G. Salomonsen, A. Lapadatu, G. Kittilsland, and B. Stark Fluxless wafer-level Cu-Sn bonding for micro- and nanosystems packaging Electronic System-Integration Technology Conference (ESTC), 2010 3rd 2010 IEEE 1 5 < http://dx.doi.org/10.1109/ESTC.2010.5643013 >
44. A. Lapadatu, T.I. Simonsen, G. Kittilsland, B. Stark, H. Hoivik, V. Dalsrud, and G. Salomonsen Cu-Sn wafer level bonding for vacuum encapsulation of microbolometer focal plane arrays Transactions of ECS 33 4 2010 73 82
45. H.H. Radamson, M. Kolahdouz, S. Shayestehaminzadeh, A.A. Farniya, and S. Wissmar Carbon-doped single-crystalline SiGe/Si thermistor with high temperature coefficient of resistance and low noise level Applied Physics Letters 97 22 2010 223507 223507-2 < http://dx.doi.org/10.1063/1.3524211 >