Self-assembly from milli- to nanoscales: Methods and applications

Journal of Micromechanics and Microengineering

Volumn 19, Issue 8, 2009, Pages

  Mastrangeli, M ^a,b   Abbasi, S ^c   Varel, C ^c   Van Hoof, C ^b   Celis, J P ^a   Bohringer K F ^c  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c UNIVERSITY OF WASHINGTON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D STRUCTURE; CAPILLARY FORCE; COLLOIDAL SELF-ASSEMBLY; DEVICE SIZES; ELECTRONIC CIRCUITRY; FABRICATION TECHNIQUE; MAGNETIC FORCE; MEMS-STRUCTURE; MICROELECTROMECHANICAL SYSTEMS; NANO SCALE; NANO-DEVICES; NUMBER OF COMPONENTS; PICK-AND-PLACE; PROCESS FLOWS; SERIAL PROCESS; SHAPE MATCHING; STOCHASTIC ASSEMBLY; THEORETICAL MODELING; THREE-DIMENSIONAL (3D);

CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; ELECTRIC FIELDS; MEMS; MICROELECTROMECHANICAL DEVICES; NANOSTRUCTURED MATERIALS; NUCLEIC ACIDS; SELF ASSEMBLY;

THREE DIMENSIONAL;

EID: 70350639482     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/8/083001     Document Type: Review

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