In-line wafer level hermetic packages for MEMS variable capacitor

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 158-163

  Obata, Susumu ^a   Inoue, Michinobu ^a   Miyagi, Takeshi ^a   Mori, Ikuo ^a   Sugizaki, Yoshiaki ^a   Shimooka, Yoshiaki ^a   Kojima, Akihiro ^a   Endo, Mitsuyoshi ^a   Shibata, Hideki ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; ATMOSPHERIC PRESSURE; ATMOSPHERIC STRUCTURE; BANDPASS FILTERS; CAPACITANCE; CAPACITORS; CHEMICAL VAPOR DEPOSITION; CHIP SCALE PACKAGES; COMPUTER NETWORKS; DIELECTRIC DEVICES; ELECTRIC EQUIPMENT; ELECTRONIC EQUIPMENT MANUFACTURE; MICROELECTROMECHANICAL DEVICES; PAPER CAPACITORS; PRESTRESSED BEAMS AND GIRDERS; RESINS; SILICON NITRIDE; VARIABLE FREQUENCY OSCILLATORS;

BEAM STRUCTURES; MEMS VARIABLE CAPACITORS;

MEMS;

EID: 51349137214     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4549963     Document Type: Conference Paper

References (7)

1. T. Ikehashi, T. Ohguro, E. Ogawa, H. Yamazaki, K. Kojima, M. Matsuo, K. Ishimaru and H. Ishiuchi, "A Robust RF MEMS Variable Capacitor with Piezoelectric and Electrostatic Actuation," IEEE MTT-S: Int. Microwave Symp. Dig., 2006, pp. 39-42.
2. Junseok Chae, Brian H. Stark and Khalil Najafi, "A Micromachined Pirani Gauge With Dual Heat Sinks," IEEE Transactions on Advanced Packaging, vol. 28, no. 4, 2005, pp. 619-625.
3. Najafi, K., "Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS", Micromachining and Microfabrication Process
4. Starek, B.H., Najafi, K., "A Low-Temperature Thin-Film Electroplated Metal Vacuum Package", Journal of Microelectromechanical Systems, Vol. 13, No. 2, pp. 147-157, April, 2004. Technology VII, Proc. OfSPIE, Vol. 4979, 2003.
5. Ikehashi, T. et al, "An RF MEMS Variable Capacitor with Intelligent Bipolar Actuation," Proc. The International Solid-State Circuits Conference, San Francisco, CA, Feb. 2008, pp. 582-583.
6. Suk-Jin Ham, Byung-Gil Jeong, Ji-Hyuk Lim, Kyu-Dong Jung, Kae-Dong Baek, Woon-Bae Kim and Chang-Youl Moon, "Characterization and Reliability Verification of Wafer-Level Hermetic Package with Nano-Liter Cavity for RF-MEMS Application," Electronic Components and Technology Conference, 2007, pp. 1127-1134.
7. J. L. Pornin, C. Gillot, G. Parat, F. Jacquet, E. Lagoutte, N. Sillon, G. Poupon and F. Dumont, "Wafer Level Thin Film Encapsulation for BAW RF MEMS," Electronic Components and Technology Conference, 2007, pp. 605-609.