Wafer-scale packaging for FBAR-based oscillators

Proceedings of the IEEE International Frequency Control Symposium and Exposition

Volumn , Issue , 2011, Pages

  Small, Martha ^a   Ruby, Rich ^a   Ortiz, Steven ^a   Parker, Reed ^a   Zhang, Fan ^b   Shi, Jianlei ^b   Otis, Brian ^b  

^a BROADCOM CORPORATION   (United States)

^b University of Washington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP-SCALE; CIRCUIT INTEGRATION; CIRCUIT TECHNOLOGY; COMMERCIAL APPLICATIONS; DUPLEXERS; FILM BULK ACOUSTIC RESONATORS; HERMETIC PACKAGES; MECHANICAL RESONATORS; TEMPERATURE-COMPENSATION; WAFER-SCALE PACKAGING;

ACOUSTIC RESONATORS; ACOUSTIC SURFACE WAVE FILTERS; OSCILLATORS (ELECTRONIC); PACKAGING; RESONATORS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; WAFER BONDING;

ELECTRONICS PACKAGING;

EID: 80155134093     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/FCS.2011.5977848     Document Type: Conference Paper

References (10)

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