Unconventional applications of wire bonding create opportunities for microsystem integration

Journal of Micromechanics and Microengineering

Volumn 23, Issue 8, 2013, Pages

  Fischer, A C ^a   Korvink, J G ^b   Roxhed, N ^a   Stemme, G ^a   Wallrabe, U ^b   Niklaus, F ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL INTERCONNECTIONS; ENERGY HARVESTER; PLACEMENT ACCURACY; PLASTIC FIBERS; SEMICONDUCTOR CHIPS; SHAPE MEMORY ALLOY ACTUATORS; THROUGH SILICON VIAS; VERSATILE TOOLS;

INTERCONNECTION NETWORKS; MICROPROCESSOR CHIPS;

WIRE;

EID: 84881141946     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/23/8/083001     Document Type: Review

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