Heterogeneous integration by adhesive bonding

Micro and Nano Systems Letters

Volumn 1, Issue 1, 2013, Pages

  Esashi, Masayoshi ^a   Tanaka, Shuji ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Adhesive bonding; Heterogeneous integration; Integrated MEMS; Wafer level transfer

Indexed keywords

EID: 85035028856     PISSN: None     EISSN: 22139621     Source Type: Journal    
DOI: 10.1186/2213-9621-1-3     Document Type: Review

References (18)

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