Wafer-level chip-to-wafer (C2W) integration of high-sensitivity MEMS and ICs

ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

Volumn , Issue , 2011, Pages 125-129

  Xu, Gaowei ^a   Yan, Peili ^a   Chen, Xiao ^a   Ning, Wenguo ^a   Luo, Le ^a   Jiao, Jiwei ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

3D hybrid integration; Chip to Wafer (C2W); dam and fill; glass frit hermetic bonding; low stress encapsulation microsystem package; Micro electromechanical systems (MEMS); wafer level package (WLP)

Indexed keywords

BARE DIES; BONDING METHODS; CAPSULATION; CHIP-TO-WAFER (C2W); CURING PROPERTIES; GLASS FRIT; HERMETIC SEALING; HIGH SENSITIVITY; HYBRID INTEGRATION; LOW STRESS; MEMSDEVICES; MICROSYSTEM PACKAGES; PROCESS YIELD; QUALITY FACTOR Q; SYSTEM PACKAGE; TECHNICAL PROCESS; THERMOMECHANICAL PROPERTIES; VACUUM PACKAGING; WAFER LEVEL; WAFER LEVEL PACKAGE; WIREBONDING;

CHIP SCALE PACKAGES; ENCAPSULATION; GLASS; GLASS BONDING; HYDRAULIC STRUCTURES; INTEGRATION; MECHANICAL PROPERTIES; MEMS; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; PACKAGING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; STRESSES; THREE DIMENSIONAL; VACUUM;

WAFER BONDING;

EID: 81355124003     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2011.6066804     Document Type: Conference Paper

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