MEMS oscillators for high volume commercial applications

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 49-52

  Lutz, M ^a   Partridge, A ^a   Gupta, P ^a   Buchan, N ^a   Klaassen, E ^a   McDonald, J ^a   Petersen, K ^a  

^a SiTime Corporation   (United States)

Author keywords

High volume manufacturing; Oscillator; Reliability; Resonator; Wafer level packaging

Indexed keywords

ACTUATORS; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; ELECTROMECHANICAL DEVICES; ELECTRONIC EQUIPMENT MANUFACTURE; ENCAPSULATION; HIGH PERFORMANCE LIQUID CHROMATOGRAPHY; MEMS; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; NONMETALS; OPTICAL DESIGN; OXIDE MINERALS; QUARTZ; SEMICONDUCTING SILICON COMPOUNDS; SENSORS; SILICON; SILICON WAFERS; TECHNOLOGY; TRANSDUCERS;

CMOS CHIPS; CMOS FABRICATION; COMMERCIAL APPLICATIONS; HIGH VOLUME MANUFACTURING; HIGH-PERFORMANCE CMOS; INTERNATIONAL CONFERENCES; LIMITING FACTORS; LONG-TERM STABILITY; LOW COSTS; MANUFACTURABILITY; MICROELECTROMECHANICAL SYSTEMS RESONATORS; OSCILLATOR; PHASE-LOCK LOOPS; RELIABILITY; RESONATOR; SEMICONDUCTOR PACKAGING; SIGNAL CONDITIONING; SMALL SIZE; SOLID-STATE SENSORS; STATE OF THE ARTS; SYSTEM ARCHITECTURES; SYSTEM INTEGRATION; TEMPERATURE DRIFTS; WAFER LEVEL PACKAGING; WAFER-LEVEL ENCAPSULATION;

ELECTRONICS PACKAGING;

EID: 50149122273     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300068     Document Type: Conference Paper

References (9)

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