Packaging of MEMS microphones

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7362, Issue , 2009, Pages

  Feiertag, Gregor ^a   Winter, Matthias ^a,b   Leidl, Anton ^a  

^a EPCOS AG   (Germany)

^b SAARLAND UNIVERSITY   (Germany)

Author keywords

Chip size MEMS package; Chip Size SAW Package, CSSP; CSMP; Flip chip; MEMS; MEMS packaging; Microphone; Packaging

Indexed keywords

CHIP SIZE MEMS PACKAGE; CHIP SIZE SAW PACKAGE, CSSP; CSMP; FLIP CHIP; MEMS PACKAGING;

ACOUSTIC SURFACE WAVE DEVICES; ACOUSTIC WAVES; ACOUSTICS; ACTUATORS; APPLICATION SPECIFIC INTEGRATED CIRCUITS; CERAMIC MATERIALS; FLIP CHIP DEVICES; MEMS; METAL FOIL; MICROELECTROMECHANICAL DEVICES; MICROPHONES; SMART SENSORS;

CHIP SCALE PACKAGES;

EID: 69949132457     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.821186     Document Type: Conference Paper

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