Multi chip module (MCM) design for packaging of a MEMS pressure sensor

6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings

Volumn , Issue , 2007, Pages 24-29

  Mohan, Ashwin ^a   Malshe, Ajay P ^a   Sriram, B ^b   Natarajan, K ^b   Mohan, S ^c  

^a UNIVERSITY OF ARKANSAS   (United States)

^b BHARAT ELECTRONICS LIMITED   (India)

^c INDIAN INSTITUTE OF SCIENCE   (India)

Author keywords

[No Author keywords available]

Indexed keywords

ASIC CHIPS; DESIGN AND DEVELOPMENT; ELECTRICAL CONNECTIONS; ENCAPSULANT; GLOB-TOP; INPUT-OUTPUT; LINEAR RESPONSE; LOW-PROFILE; METAL-BASE; MULTI-CHIP MODULE; OUTSIDE DIAMETER; PACKAGE DESIGNS; PACKAGED DEVICES; PHYSICAL DAMAGES; PIEZORESISTIVE; POLYMER SUBSTRATES; PRESSURE CONDITIONS; RELIABILITY TESTING; SELECTIVE ELECTROPLATING; SENSOR PACKAGING; TEMPERATURE CYCLING; WIRE BONDING; WIRE BONDS;

ADHESIVES; APPLICATION SPECIFIC INTEGRATED CIRCUITS; CABLES; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; COPPER; DIES; ELECTRIC CONNECTORS; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; ELECTROPLATING; GOLD; INTEGRATED CIRCUITS; MEMS; METALLIZING; METALS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; MICROPROCESSOR CHIPS; MODEMS; NICKEL; NONMETALS; PAINTING; PHOTONICS; PHOTORESISTS; POLYMERS; PRESSURE SENSORS; PRESSURE TRANSDUCERS; SENSORS; SILICON; TESTING; WIRE;

ELECTRONICS PACKAGING;

EID: 49949116866     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2007.4339131     Document Type: Conference Paper

References (17)

1. Bryzek J. Silicon sensors and microstructures. Electro International. Conference Record 16-18 April 1999; p. 661-5.
2. Wilner, Leslie B., Piezoresistive Transducer, US Patent 4793194, 1987; Poff R, Low profile microsensor for aerodynamic pressure measurement, Endevco Technical Paper, TP 297; Chavan A.V., Wise K.D., A monolithic fully-integrated vacuum-sealed CMOS pressure sensor, IEEE Trans. Electron Devices 2002;49:164-9.
3. Xiao GW, Chan PCH, Teng A, Jian C, Yuen MMF. A pressure sensor using flip-chip on low-cost flexible substrate. Proc. of 51st ECTC 2001; 750-4.
4. Lee GB et al. Robust vortex control of a delta wing by distributed microelectromechanical-systems actuators. Journal of Aircraft 2000; 37: 697-706.
5. Malshe AP, O'Neal CB, Singh SB, Brown WD, Eaton WP, Miller WM. Challenges in the packaging of MEMS. International Journal of Microcircuits and Electronic Packaging 1999; 22:233-41.
6. Piezoresistive pressure transducers instruction manual, Endevco, IM 8500, Rev. B, Feb 24, 1997.
7. Bergstresser TR, Sallo JS. Copper on polyimide flexible substrate for ultra-thin, high, performance applications. Gould Electronics Inc., Electronic Materials.
8. Harman GG, Wire bonding to multichip modules and other soft substrates. J. Multi Chip Modules with Integrated Sensors 1996; 47-62
9. Tai-Ran Hsu, MEMS Packaging, INSPEC, The Institute of Electrical Engineers, London: 2004.
10. Sparks DR. Packaging of microsystems for harsh environments. IEEE Instrumentation & Measurement Magazine 2001; 4: 30-3.
11. Ganasan JR. Chip on chip (COC) and chip on board (COB) assembly on flex rigid printed circuit assemblies. IEEE Trans. Electronics Manufacturing Manufacturing 2000; 23: 28-31
12. Harman GG, Johnson CE. Wire bonding to advanced copper, low-k integrated circuits, the metal/ dielectric stacks, and materials considerations. IEEE Trans. Components and Packaging Technologies 2002; 25: 677-83
13. Eaton WP, Smith JH. Micromachined pressure sensors: review and recent developments. Proc. of the SPIE - the International Society for Optical Engineering 1997; 3046:30-41.
14. Hall E, Lyons AM, Weld JD. Gold wire bonding onto flexible polymeric substrates. IEEE Trans on Components, Packaging and Manufacturing Technology 1996; 19: 12-7
15. Monk DJ, Shah MK. Packaging and Testing Considerations of Bulk Micromachined, Piezoresistive Pressure Sensors. Motorola Sensor Products Division.
16. Brown WD. Advanced Electronic Packaging: With Emphasis on Multichip Modules. IEEE Press, New York, 1999.
17. Murarka SP, Hymes SW. Copper metallization for ULSI and beyond. Critical Reviews in Solid and Material Sciences 1995; 20:87-124.