Piezoelectric acoustic wave devices based on heterogeneous integration technology

IFCS 2014 - 2014 IEEE International Frequency Control Symposium, Proceedings

Volumn , Issue , 2014, Pages

  Tanaka, Shuji ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

PIEZOELECTRICITY; THERMAL EXPANSION; WIRELESS TELECOMMUNICATION SYSTEMS;

ACOUSTIC WAVE DEVICE; DIE SIZE; FREQUENCY SELECTION; HETEROGENEOUS INTEGRATION; NETWORK SENSORS; PROCESS TEMPERATURE; THERMAL EXPANSION MISMATCH; WIRELESS COMMUNICATIONS;

ACOUSTIC WAVES;

EID: 84906871347     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/FCS.2014.6859994     Document Type: Conference Paper

References (15)

1. 3 MEMS-on-CMOS Tactile Sensor Using Human-Inspired Autonomous Common Bus Communication," Transducers 2013, Barcelona, Spain, June 16-20, 2013, pp. 2729-2732.
2. R. L. Kubena et al., "UHF Quartz MEMS Oscillators for Dynamics-Based System Enhancements," 2013 IEEE Int. Freq. Contr. Symp., Prague, Czech Republic, 21-25 July, 2013, pp. 1-8.
3. Abhay Kochhar et al., "Monolithic Fabrication of Film Bulk Acoustic Resonators above Integrated Circuit by Adhesive-Bonding-Based Film Transfer," 2012 IEEE Int. Ultrason. Symp., Dresden, Germany, October 7-10, 2012, pp. 1047-1050.
4. Takeshi Matsumura et al., "Multi-band radio-frequency filters fabricated by using polyimide-based membrane transfer bonding technology," J. Micromech. Microeng., 20 (2010) 095027.
5. Matsuo Kousuke et al., "Low-Voltage PZT-Actuated MEMS Switch Monolithically Integrated with CMOS Circuit," 25th IEEE MEMS 2012, Paris, France, January 29 - February 2, 2012, pp. 1153-1156.
6. Martha Small et al., "Wafer-scale Packaging for FBAR-based Oscillators," 2011 IEEE Int. Freq. Contr. Symp., San Francisco, USA, May 2-5, 2011.
7. Kousuke Hikichi et al., "FBAR-IC Integration by Wafer-level Selective Device Transfer," 2014 IEEE Int. Freq. Contr. Symp., Taipei, Taiwan, May 19-22, 2014.
8. Shuji Tanaka et al., "Lithium-Niobate-Based Surface Acoustic Wave Oscillator Directly Integrated with CMOS Sustaining Amplifier," IEEE Trans. Ultrason. Ferroelectr. Freq. Contr., 59 (2012) pp. 1800-1805.
9. Shuji Tanaka et al., "Lithium Niobate SAW Device Hetero-transferred onto Silicon Integrated Circuit Using Elastic and Sticky Bumps," 2012 IEEE Int. Ultrason. Symp., Dresden, Germany, October 7-10, 2012, pp. 295-298.
10. Toshiki Yasue et al., "Wideband Tunable Love Wave Filter Using Electrostatically-Actuated MEMS Variable Capacitors Integrated on Lithium Niobate," Sens. Actuators A, 188 (2012) pp. 456-462.
11. Hideki Hirano et al., "Integration of BST varactors with surface acoustic wave device by film transfer technology for tunable RF filters," J. Micromech. Microeng., 23 (2013) 025005.
12. T. Samoto et al., "Wafer-to-Wafer Transfer Process of Barium Strontium Titanate Metal-Insulator-Metal Structures by Laser Preirradiation and Gold-Gold Bonding for Frequency Tuning Applications," Transducers 2013, Barcelona, Spain, June 16-20, 2013, pp. 171-174.
13. The National Institute of Information and Communications Technology (NICT), Press release, "Wireless communication in TV white space succeeded", http://www.nict.go.jp/en/press/2012/06/07en-1.html, June 7, 2012.
14. Tohoku University, Press release, "Development of a one-chip tunable SAW filter for wireless communication utilizing vacant digital television broadcasting frequencies (TV white spaces)", http://www.tohoku.ac.jp/ english/2014/02/press20140224-01.html, February 24, 2014.
15. 3," 2013 IEEE Int. Ultrason. Symp., Prague, Czech Republic, July 21-25, 2013, pp. 1680-1683.