Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS

IEEE Journal on Selected Topics in Quantum Electronics

Volumn 17, Issue 3, 2011, Pages 629-644

  Lapisa, Martin ^a   Stemme, Göran ^a   Niklaus, Frank ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Microelectromechanical system (MEMS); microoptoelectromechanical system (MOEMS); More than Moore; nanoelectromechanical system (NEMS); photonic integration; self assembly; wafer level heterogeneous integration

Indexed keywords

MICROOPTOELECTROMECHANICAL SYSTEM (MOEMS); MORE-THAN-MOORE; NANOELECTROMECHANICAL SYSTEM (NEMS); PHOTONIC INTEGRATION; WAFER LEVEL;

COMPOSITE MICROMECHANICS; DISSIMILAR MATERIALS; GRAPHENE; INTEGRATION; MECHATRONICS; MICROELECTROMECHANICAL DEVICES; MONOCRYSTALLINE SILICON; NEMS; PHOTONIC INTEGRATION TECHNOLOGY; SILICON WAFERS;

MOEMS;

EID: 79958280952     PISSN: 1077260X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSTQE.2010.2093570     Document Type: Article

References (135)

1. M. J. Madou, Fundamentals of Microfabrication: The Science of Miniaturization. Boca Raton, FL: CRC Press, 2002.
2. G. K. Fedder, R. T. Howe, T.-J. K. Liu, and E. P. Quevy, "Technologies for cofabricating MEMS and electronics", in Proc. IEEE, Jan. 2008, vol. 96, no. 2, pp. 306-322.
3. O. Brand, "Microsensor integration into systems-on-chip", in Proc. IEEE, Jul. 2006, vol. 94, no. 6, pp. 1160-1176.
4. J. Bryzek, A. Flannery, and D. Skurnik, "Integrating micromechanical systems with integrated circuits", IEEE Instrum. Meas. Mag., pp. 51-59, Jun. 2004.
5. R. R. Tummala, Fundamentals of Microsystems Packaging. New York: McGraw-Hill, 2001.
6. F. Niklaus, J. J. McMahon, J. Yu, S. H. Lee, J.-Q. Lu, T. S. Cale, and R. J. Gutmann, "Wafer-level 3D integration technology platforms for ICs and MEMS", in Proc. VMIC, Fremont, CA, 2005, pp. 486-493.
7. (2008). International Technology Roadmap for Semiconductors, ITRS 2008 Update [Online]. Available: http://www.itrs.net
8. T.-R. Hsu, MEMS Packaging, INSPEC, Inst. Electr. Eng., London, U. K., 2004.
9. M. Esashi, "Wafer level packaging of MEMS", J. Micromech. Microeng., vol. 18, 073001, 2008.
10. J. Bryzek, S. Nasiri, A. Flannery, H. Kwon, M. Novack, D. Marx, E. Sigari, E. Chen, and J. Garate, "Very large scale integration of MOEMS mirrors, MEMS angular amplifiers and high-voltage, high-density IC electronics for photonic switching", Nanotech, vol. 2, pp. 428-431, 2003.
11. S. Nasiri, "Wafer level packaging of MOEMS solves manufacturability challenges in optical cross connect", presented at IEEE Photonic Devices Syst. Packag. Symp. 2003, San Francisco, CA.
12. C. L. Shieh, J. Y. Chi, C. A. Armiento, P. O. Haugsjaa, A. Negri, and W. I. Wang, "A 1.3 μm InGaAsP ridge waveguide laser on GaAs and Si substrates by thin-film transfer", Electron. Lett., vol. 27, pp. 850-851, 1991. (Pubitemid 21669262)
13. K. H. Calhoun, C. B. Camperi-Ginestet, and N. M. Jokerst, "Vertical optical communication through stacked silicon wafers using hybrid monolithic thin film InGaAsP emitters and detectors", IEEE Photon. Technol. Lett., vol. 5, no. 2, pp. 254-257, Feb. 1993. (Pubitemid 23632906)
14. A. Goyal, J. Cheong, and S. Tadigadapa, "Tin-based solder bonding for MEMS fabrication and packaging applications", J. Micromech. Microeng., vol. 14, no. 6, pp. 819-825, 2004.
15. C.-W. Lin, H.-A. Yang, W. C. Wang, and W. Fang, "Implementation of threedimensional SOI-MEMS wafer-level packaging using throughwafer interconnections", J. Micromech. Microeng., vol. 17, no. 6, pp. 1200-1205, 2007. (Pubitemid 46838936)
16. P. Robogiannakis, E. Kyriakis-Bitzaros, K. Minoglou, S. Katsafouros, A. Kostopoulos, G. Konstantinidis, and G. Halkias, "Metallic bonding methodology for heterogeneous integration of optoelectronic dies to CMOS circuits", Microelectron. Eng., vol. 85, no. 4, pp. 727-732, 2008.
17. S. Nasiri. New innovations in MEMS fabrications are responsible for meeting the demand for low-cost inertial sensors for consumer markets. White Paper [Online]. Available: http://www.invensense.com
18. R. Wolffenbuttel and K. D. Wise, "Low-temperature silicon wafer-towafer bonding using gold at eutectic temperature", Sen. Actuators A: Phy., vol. A43, no. 1-3, pp. 223-229, 1994.
19. A.-L. Tiensuu, M. Bexell, J.-A. Schweitz, L. Smith, and S. Johansson, "Assembling three-dimensional microstructures using gold-silicon eutectic bonding", Sen. Actuators A: Phy., vol. A45, no. 3, pp. 227-236, 1994.
20. R. Wolffenbuttel, "Low-temperature intermediate Au-Si wafer bonding; eutectic or silicide bond", Sen. Actuators A: Phy., vol. A62, no. 1-3, pp. 680-686, 1997. (Pubitemid 127389660)
21. S. Lani, A. Bosseboeuf, B. Belier, C. Clerc, C. Gousset, and J. Aubert, "Gold metallizations for eutectic bonding of silicon wafers", Microsyst. Technol., vol. 12, no. 10/11, pp. 1021-1025, 2006. (Pubitemid 44267995)
22. P. Chen, C. Lin, and C. Liu, "Amorphous Si/Au wafer bonding", Appl. Phy. Lett., vol. 90, no. 13, pp. 132120-1-132120-3, 2007.
23. H. Gradin, S. Braun, M. Sterner, G. Stemme, and W. van der Wijngaart, "Selective electrochemical release etching of eutectically bonded microstructures", in Proc. IEEE Transducers, Denver, CO, 2009, pp. 743-746.
24. H. Gradin, S. Braun, G. Stemme, and W. Van DerWijngaart, "Localized removal of the Au-Si eutectic bonding layer for the selective release of microstructures", J. Micromech. Microeng., vol. 19, no. 10, pp. 105014-105023, 2009.
25. S. Braun, "Wafer-level heterogeneous integration of MEMS actuators", Ph. D. dissertation, KTH-Royal Institute of Technology, Stockholm, Sweden, 2010.
26. M. M. Maharbiz, R. T. Howe, and K. S. J. Pister, "Batch transfer assembly of micro-components onto surface and SOI MEMS", in Proc. Transducers, Sendai, Japan, 1999, pp. 1478-1481.
27. V. Milanovic, M. Maharbiz, and K. S. J. Pfister, "Batch transfer integration of RF microrelays", IEEE Microw. Guided Wave Lett., vol. 10, no. 8, pp. 315-315, 2000.
28. V. Milanovic, M. Maharbiz, A. Singh, B. Warneke, N. Zhou, H. K. Chan, and K. S. Pfister, "Microrelays for batch transfer integration in RF systems", in Proc. IEEE MEMS, Miyazaki, Japan, 2000, pp. 787-792.
29. M. A. Michalicek and V. M. Bright, "Flip-chip fabrication of advanced micromirror arrays", in Proc. MEMS, Interlaken, Switzerland, 2001, pp. 313-316. (Pubitemid 32470812)
30. M. A. Michalicek and V. M. Bright, "Flip-chip fabrication of advanced micromirror arrays", Sen. Actuators A: Phy., vol. 95, no. 2/3, pp. 152-167, 2002. (Pubitemid 34061303)
31. P. R. Morrow, C.-M. Park, S. Ramanathan, M. J. Kobrinsky, and M. Harmes, "Three-dimensional wafer stacking via Cu-Cu bonding integrated with 65-nm strained-Si/low-k CMOS technology", IEEE Electron Device Lett., vol. 27, no. 5, pp. 335-337, 2006.
32. P. Gueguen, L. D. Cioccia, J. P. Gonchond, P. Gergaud, M. Rivoire, D. Scevola, M. Zussy, D. Lafond, and L. Clavelier, "3D vertical interconnects by copper direct bonding", in Proc. MRS, 2009, vol. 1112, p. 81.
33. M. Despont, U. Drechsler, R. Yu, H. B. Pogge, and P. Vettiger, "Waferscale microdevice transfer/interconnect: From a new integration method to its application in an AFM-based data-storage system", in Proc. Transducers, Boston, MA, vol. 2, 2003, pp. 1907-1910.
34. M. Despont, U. Drechsler, R. Yu, H. B. Pogge, and P. Vettiger, "Waferscale microdevice transfer/interconnect: its application in an AFM-based data-storage system", J. Microelectromech. Syst., vol. 13, no. 6, pp. 895-901, 2004. (Pubitemid 40009490)
35. R. Guerre, U. Drechsler, D. Jubin, and M. Despont, "Selective transfer technology for microdevice distribution", IEEE J. Microelectromech. Syst., vol. 17, no. 1, pp. 157-165, Feb. 2008. (Pubitemid 351343929)
36. R. Guerre, U. Drechsler, D. Jubin, and M. Despont, "Low-cost AFM cantilever manufacturing technology", J. Micromech. Microeng., vol. 18, 115013, 2008.
37. T. Grund, R. Guerre, M. Despont, and M. Kohl, "Transfer bonding technology for batch fabrication of SMA microactuators", Eur. Phy. J. Special Topics, vol. 158, no. 1, pp. 237-242, 2008.
38. R. Guerre, U. Drechsler, D. Bhattacharyya, P. Rantakari, R. Stutz, R. V. Wright, Z. D. Milosavljevic, T. Vaha-Heikkila, P. B. Kirby, and M. Despont, "Wafer-level transfer technologies for PZT-based RFMEMS switches", J. Microelectromech. Syst., vol. 19, no. 3, pp. 548-560, 2010.
39. L. Dellmann, U. Drechsler, T. Morf, H. Rothuizen, R. Stutz, J. Weiss, and M. Despont, "3D electro-optical device stacking on CMOS", Microelectron. Eng., vol. 87, pp. 1210-1212, 2010.
40. J. J. McMahon, F. Niklaus, R. J. Kumar, J. Yu, J.-Q. Lu, and R. J. Gutmann, "CMP compatibility of partially cured benzocyclobutene (BCB) for a via-first 3D IC process", in Proc. MRS, San Francisco, CA, vol. 867, 2005, pp. W4.4.1-W4.4.6.
41. R. J. Gutmann, J. J. McMahon, S. Rao, F. Niklaus, and J.-Q. Lu, "Wafer-level via-first 3D integration with hybrid-bonding of Cu/BCB redistribution layers", in Proc. IWLPC, San Jose, CA, 2005.
42. J. J. McMahon, R. J. Kumar, F. Niklaus, S. H. Lee, J. Yu, J.-Q. Lu, and R. J. Gutmann, "Unit processes for Cu/BCB redistribution layer bonding for 3D ICs", in Proc. Adv. Metaliz. Conf., 2005, pp. 179-183.
43. P. De Moor, W. Ruythooren, P. Soussan, B. Swinnen, K. Baert, C. Van Hoof, and E. Beyne, "Recent advances in 3D integration at IMEC", in Proc. MRS, 2007, vol. 970 3, pp. 3-12. (Pubitemid 46973308)
44. A. Jourdain, S. Stoukatch, P. De Moor, and W. Ruythooren, "Simultaneous Cu-Cu and compliant dielectric bonding for 3D stacking of ICs", in Proc. IITC, San Francisco, CA, 2007, pp. 207-209. (Pubitemid 47487191)
45. F. Liu, R. R. Yu, A. M. Young, J. P. Doyle, X. Wang, L. Shi, K.-N. Chen, X. Li, D. A. Dipaola, D. Brown, C. T. Ryan, J. A. Hagan, K. H. Wong, M. Lu, X. Gu, N. R. Klymko, E. D. Perfecto, A. G. Merryman, K. A. Kelly, S. Purushothaman, S. J. Koester, R. Wisnieff, and W. Haensch, "A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding", in Proc. IEDM, San Francisco, CA, 2008, pp. 1-4.
46. reg;) as drivers for volume commercialization of 3-D integration architectures and applications", in Proc. MRS, 2009, vol. 1112, p. 33.
47. P. Gueguen, L. D. Cioccia, J. P. Gonchond, P. Gergaud, M. Rivoire, D. Scevola, M. Zussy, D. Lafond, and L. Clavelier, "3D vertical interconnects by copper direct bonding", in Proc. MRS, 2009, vol. 1112, p. 81.
48. P. Enquist, G. Fountain, C. Petteway, A. Hollingsworth, and H. Grady, "Low cost of ownership scalable copper direct bond interconnect 3D IC technology for three dimensional integrated circuit applications", in Proc. IEEE 3D Syst. Integr., Munich, Germany, 2009, pp. 1-6.
49. A. Roer, A. Lapadatu, A. Elfving, G. Kittilsland, and E. Hohler, "Low cost, high performance Far Infrared microbolometer", presented at SPIE, Brussels, Belgium, vol. 7726, pp. 77260Z, 2010.
50. Handbookof 3D Integration: Technology And Applications Of 3D Integrated Circuits, P. Garrou, C. Bower, and P. Ramm, Eds. Wiley-VCH Verlag GmbH & Co., Weinheim, Germany, 2008.
51. J. Gu, W. T. Pike, and W. J. Karl, "A novel vertical solder pump structure for through-wafer interconnects", in Proc. MEMS, Hong Kong, China, 2010, pp. 500-503.
52. A. Fischer, N. Roxhed, G. Stemme, and F. Niklaus, "Low-cost through silicon vias (TSVs) with wire-bonded metal cores and low capacitive substrate-coupling", in Proc. MEMS, Hong Kong, China, 2010, pp. 480-483.
53. A. C. Fischer, N. Roxhed, T. Haraldsson, N. Heinig, G. Stemme, and F. Niklaus, "Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wires", in Proc. IEEE MEMS, Cancun, Mexico, 2011.
54. T. Bauer. First high volume via process for packaging and integration of MEMS/CMOS. White Paper, Silex Micvrosystems [Online] Available: http://www.silexmicrosystems.com
55. H. Kuisma, "Wafer level packaging of MEMS", presented at Smart Syst. Integr. Conf., Barcelona, Spain, 2008.
56. T. Baumgartner, M. Töpper, M. Klein, B. Schmid, D. Knödler, H. Kuisma, S. Nurmi, H. Kattelus, J. Dekker, and R. Schachler, "A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level", in Proc. EMPC, Rimini, Italy, 2009, pp. 1-5.
57. MEMS Process Review Report, "Inven Sense IDG-300 dual-axis angular rate gyroscope sensor", Chipworks, Ottawa, ON, Canada, MPR-0702-801, 2007.
58. (2010, Nov. 9). Press Release [Online]. Available: http://www.invensense. com
59. I. W. Jung, Y.-A. Peter, E. Carr, J.-S. Wang, and O. Solgaard, "Single crystal silicon continuous membrane deformable mirror array for adaptive optics", in Proc. Opt. MEMS Their Appl. Conf., 2006, pp. 152-153. (Pubitemid 351471321)
60. I. W. Jung, Y.-A. Peter, E. Carr, J.-S. Wang, and O. Solgaard, "Singlecrystalsilicon continuous membrane deformable mirror array for adaptive optics in space-based telescopes", IEEE J. Sel. Topics Quant. Electron., vol. 13, no. 2, pp. 162-167, Mar./Apr. 2007. (Pubitemid 46652352)
61. E.-H. Yang and D. V. Wiberg, "A new wafer-level membrane transfer technique for MEMS deformable mirrors", in Proc. MEMS, Interlaken, Switzerland, 2001, pp. 80-83. (Pubitemid 32470758)
62. E.-H. Yang and D. V. Wiberg, "A wafer-scale membrane transfer process for the fabrication of optical quality, large continuous membranes", J. Microelectromech. Syst., vol. 12, no. 6, pp. 804-815, 2003.
63. E-H. Yang, K. Shcheglov, and S. Troloer-McKinstry, "Concept, modeling and fabrication techniques for large-stroke piezoelectric unimorph deformable mirrors", in Proc. SPIE Photonics West, 2003, vol. 4985, pp. 271-278.
64. E.-H. Yang, Y. Hishinuma, J.-G. Cheng, S. Trolier-McKinstry, E. Bloemhof, and B. M. Levine, "Thin-film piezoelectric unimorph actuator-based deformable mirror with a transferred silicon membrane", J. Microelectromech. Syst., vol. 15, no. 5, pp. 1214-1225, 2006. (Pubitemid 44566940)
65. A. Javey, S. W. Nam, R. S. Friedman, H. Yan, and C. M. Lieber, "Layerbylayer assembly of nanowires for three-dimensional, multifunctional electronics", Nano Lett., vol. 7, no. 3, pp. 773-777, 2007. (Pubitemid 46516064)
66. R. Yerushalmi, Z. A. Jacobson, J. C. Ho, Z. Fan, and A. Javey, "Large scale, highly ordered assembly of nanowire parallel arrays by differential roll printing", Appl. Phy. Lett., vol. 91, p. 203104, 2007.
67. X. Feng, M. A. Meitl, A. M. Bowen, Y. Huang, R. G. Nuzzo, and J. A. Rogers, "Competing fracture in kinetically controlled transfer printing", Langmuir, vol. 23, pp. 12555-12560, 2007. (Pubitemid 350275573)
68. H. Onoe, E. Iwase, K. Matsumoto, and I. Shimoyama, "Threedimensional integration of heterogeneous silicon micro-structures by liftoff and stamping transfer", J. Micromech. Microeng., vol. 17, pp. 1818-1827, 2007.
69. H. Onoe, E. Iwase, K. Matsumoto, and I. Shimoyama, "3D integration of heterogeneous MEMS structures by stamping transfer", in Proc. MEMS, Kobe, Japan, 2007, pp. 175-178.
70. M. Liu, W. M. Lau, and J. Yang, "On-demand multi-batch self-assembly of hybrid MEMs by patterning solders of different melting points", J. Micromech. Microeng., vol. 17, pp. 2163-2168, 2007. (Pubitemid 350037293)
71. G. M. Whitesides and B. Grzybowski, "Self-assembly at all scales", Science, vol. 295, pp. 2418-2421, 2002. (Pubitemid 34270248)
72. R. R. A. Syms, E. M. Yeatman, V. M. Bright, and G. M. Whitesides, "Surface tension-powered self-assembly of microstructures-The stateofthe-art", J. Microelectromech. Syst., vol. 12, no. 4, pp. 387-417, 2003.
73. M. Mastrangeli, S. Abbasi, C. Varel, C. Van Hoof, J.-P. Celis, and K. F. Böhringer, "Self-assembly from milli-to nanoscales: methods and applications", J. Micromech. Microeng., vol. 19, no. 8, p. 083001, 2009.
74. F. Niklaus, G. Stemme, J.-Q. Lu, and R. J. Gutmann, "Adhesive wafer bonding", J. Appl. Phy., Appl. Phy. Rev. Focused Rev., vol. 99, no. 1, pp. 031101.1-031101.28, 2006.
75. F. Niklaus, P. Enoksson, E. Kälvesten, and G. Stemme, "Void-free full wafer adhesive bonding", in Proc. MEMS, Miyazaki, Japan, 2000, pp. 247-252.
76. F. Niklaus, P. Enoksson, E. Kälvesten, and G. Stemme, "Lowtemperature full wafer adhesive bonding", J. Micromech. Microeng., vol. 11, no. 2, pp. 100-107, 2001. (Pubitemid 32266023)
77. F. Niklaus, H. Andersson, P. Enoksson, and G. Stemme, "Low temperature full wafer adhesive bonding of structured wafers", Sen. Actuators A, vol. 92, no. 1-3, pp. 235-241, 2001. (Pubitemid 32697902)
78. F. Niklaus, "Adhessive wafer bonding for microelectronic and microelectromechanical systems", Ph. D. dissertation, KTH-Royal Institute of Technology, Stockholm, Sweden, 2002.
79. F. Niklaus, R. J. Kumar, J. J. McMahon, J. Yu, J.-Q. Lu, T. S. Cale, and R. J. Gutmann, "Adhesive wafer bonding using partially curred benzocyclobutene (BCB) for three-dimensional integration", J. Electrochem. Soc., vol. 153, no. 4, pp. G291-G295, 2006. (Pubitemid 43352259)
80. M. Populin, A. Decharat, F. Niklaus, and G. Stemme, "Thermosetting nano-imprint resists: Novel materials for adhesive wafer bonding", in Proc. MEMS, Kobe, Japan, 2007, pp. 239-242.
81. F. Niklaus, A. Decharat, F. Forsberg, N. Roxhed, M. Lapisa, M. Populin, F. Zimmer, J. Lemm, and G. Stemme, "Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integratedcircuit (SOIC) wafers in 3D integration of MEMS and ICs", Sen. Actuators A: Phy., vol. 154, pp. 180-186, 2009.
82. F. Niklaus, "Adhesive wafer bonding, applications and trends", presented at ECS Wafer Bonding Symp., Las Vegas, NV, 2010.
83. Q.-Y. Tong, G. Fountain, and P. Enquist, "Room temperature SiO2/SiO2 covalent bonding", Appl. Phy. Lett., vol. 89, pp. 042110-1-042110-3, 2006.
84. P. Enquist, "Room temperature direct wafer bonding for three dimensional integrated sensors", Sen. Materials, vol. 17, no. 6, pp. 307-316, 2005. (Pubitemid 41712355)
85. H. Wada and T. Kamijoh, "Room-temperature CW operation of InGaAsP lasers on Si fabricated by wafer bonding", Photon. Tech. Lett., vol. 8, no. 2, pp. 173-175, 1996. (Pubitemid 126546818)
86. N. M. Jokerst, M. A. Brooke, S.-Y. Cho, S. Wilkinson, M. Vrazel, S. Fike, J. Tabler, Y. J. Joo, S.-W. Seo, D. S. Wills, and A. Brown, "The heterogeneous integration of optical interconnections into integrated microsystems", IEEE J. Sel. Topics Quan. Electron., vol. 9, no. 2, pp. 350-360, Mar./Apr. 2003.
87. D. Liang, G. Roelkens, R. Baets, and J. E. Bowers, "Hybrid integrated platforms for silicon photonics", Materials, vol. 3, pp. 1782-1802, 2010.
88. S. Haasl, F. Niklaus, and G. Stemme, "Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding", in Proc. MEMS, Kyoto, Japan, 2003, pp. 271-274.
89. F. Niklaus, S. Haasl, and G. Stemme, "Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding", IEEE J. Microelectromech. Syst., vol. 12, no. 4, pp. 465-469, Aug. 2003.
90. T. Bakke, B. Völker, D. Rudloff, M. Friedrichs, H. Schenk, and H. Lakner, "Large scale, drift free monocrystalline silicon micromirror arrays made by wafer bonding", in Proc. SPIE, 2006, vol. 6114, pp. 02.1-02.7.
91. F. Zimmer, M. Lapisa, T. Bakke, M. Bring, G. Stemme, and F. Niklaus, "1-Megapixel mono-crystalline silicon micro-mirror array on CMOS driving electronics manufactured with very large scale heterogeneous system integration", IEEE J. Microelectromech. Syst., to be published.
92. F. Zimmer, M. A. Lapisa, T. Bakke, M. Bring, G. Stemme, and F. Niklaus, "Very large scale heterogeneous system integration for 1-megapixel mono-crystalline silicon micro-mirror array on CMOS driving electronics", in Proc. IEEE MEMS, Cancun, Maxico, 2011.
93. M. A. Lapisa, F. Zimmer, A. Gehner, G. Stemme, and F. Niklaus, "Hidden-hinge micro-mirror arrays made by heterogeneous integration of two mono-crystalline silicon layers", in Proc. IEEE MEMS, Cancun, Maxico, 2011.
94. F. Niklaus, E. Kälvesten, and G. Stemme, "A new concept for CMOScompatible fabrication of uncooled infrared focal plane arrays using wafer-scale device transfer bonding", in Proc. SPIE, 2001, vol. 4369, pp. 397-404.
95. F. Niklaus, E. Kälvesten, and G. Stemme, "Wafer-level membrane transfer bonding of polycrystalline silicon bolometers for use in infrared focal plane arrays", J. Micromech. Microeng., vol. 11, pp. 509-513, 2001. (Pubitemid 32897674)
96. F. Niklaus, J. Pejnefors, M. Dainese, M. Haggblad, P.-E. Hellström, U. J. Wallgren, and G. Stemme, "Characterization of transfer-bonded silicon bolometer arrays", in Proc. SPIE, Orlando, FL, vol. 5406, 2004, pp. 521-530.
97. F. Forsberg, N. Roxhed, P. Ericsson, S. Wissmar, F. Niklaus, and G. Stemme, "High-performance quantum-well silicon-germanium bolometers using IC-compatible integration for low-cost infrared imagers", in Proc. Transducers, Denver, CO, 2009, pp. 2214-2217.
98. A. Fischer, M. A. Lapisa, N. Roxhed, M. Antelius, G. Stemme, and F. Niklaus, "Selective electroless nickel plating on oxygen-plasma activated gold seed layers for the fabrication of low-contact resistance vias and microstructures", in Proc. MEMS, Hong Kong, China, 2010, pp. 472-475.
99. M. A. Lapisa, F. Zimmer, F. Niklaus, A. Gehner, and G. Stemme, "CMOS-integrable piston-type micromirror array for adaptive optics made of mono-crystalline silicon using 3-D integration", in Proc. MEMS, Sorrento, Italy, 2009, pp. 1007-1010.
100. T. Bakke, M. Friedrichs, B. Völker, M. Reiche, L. Leonardsson, H. Schenk, and H. Lakner, "Spatial light modulators with monocrystalline silicon micromirrors made by wafer bonding", in Proc. SPIE, 2005, vol. 5715, pp. 69-80.
101. T. Bakke, B. Völker, H. Schenk, I. Radu, and M. Reiche, "Wafer bonding for optical MEMS", in Proc. ECS, PV2005-02, 2005, pp. 184-193. (Pubitemid 43182096)
102. A. W. Topol, D. C. La Tulipe Jr., L. Shi, D. J. Frank, K. Bernstein, S. E. Steen, A. Kumar, G. U. Singco, A. M. Young, K. W. Guarini, and M. Ieong, "Three-dimensional integrated circuits", IBM J. Res. Dev., vol. 50, no. 4/5, pp. 491-506, 2006. (Pubitemid 44364166)
103. T. Akiyama, U. Staufer, and N. F. de Rooij, "Wafer-and piece-wise Si tip transfer technologies for applications in scanning probe microscopy", J. Microelectromech. Syst., vol. 8, no. 1, pp. 65-70, 1999.
104. F. Zimmer, F. Niklaus, M. Lapisa, T. Ludewig, M. Bring, M. Friedrichs, T. Bakke, H. Schenk, and W. van der Wijngaart, "Fabrication of largescale mono-crystalline silicon micro-mirror arrays using adhesive wafer transfer bonding", in Proc. SPIE, San Jose, CA, vol. 7208, 2009, pp. 720807-1-720807-9.
105. S. Braun, N. Sandstrom, G. Stemme, and W. van der Wijngaart, "Waferscale manufacturing of bulk shapememory alloy microactuators based on adhesive bonding of titanium-nickel sheets to structured silicon wafers", J. Microelectromech. Syst., vol. 18, no. 6, pp. 1309-1317, 2009.
106. M. Sterner, D. Chicherin, A. V. Räisänen, G. Stemme, and J. Oberhammer, "RFMEMS high-impedance tuneable metamaterials for millimeter wave beam steering", in Proc. MEMS, Sorrento, Italy, 2009, pp. 896-899.
107. S. H. Lee, F. Niklaus, R. J. Kumar, H.-F. Li, J. J. McMahon, J. Yu, J.-Q. Lu, T. S. Cale, and R. J. Gutmann, "Fine keyed alignment and bonding for wafer-level 3D ICs", in Proc. MRS, San Francisco, CA, vol. 914, 2006, pp. 433-438. (Pubitemid 44544682)
108. F. Niklaus, P. Enoksson, E. Kälvesten, and G. Stemme, "A method to maintain wafer alignment precision during adhesive wafer bonding", Sen. Actuators A, vol. 107, no. 3, pp. 273-278, 2003.
109. N. Somjit, G. Stemme, and J. Oberhammer, "Binary-coded 4.25-bit wband monocrystalline-silicon MEMS multi-stage dielectric-block phase shifters", IEEE/MTT-S Trans. Microw. Theory Technol., vol. 57, no. 11, pp. 2834-2840, Sep. 2009.
110. F. Saharil, R. V. Wright, P. Rantakari, P. B. Kirby, T. Vähä-Heikkilä, F. Niklaus, G. Stemme, and J. Oberhammer, "Low-temperature CMOScompatible 3D-integration of monocrystalline-silicon based PZT RF MEMS switch actuators on RF substrates", in Proc. MEMS, Hong Kong, China, 2010, pp. 47-50.
111. T. Matsumura, M. Esashi, H. Harada, and S. Tanaka, "Multi-band RF filter integrating different modes of AlN resonator by CMOS-compatible process", in Proc. Ultrason. Symp. (IUS), Rome, Italy, 2009, pp. 2141-2144.
112. T. Matsumura, M. Esashi, H. Harada, and S. Tanaka, "Multi-band radiofrequency filters fabricated using polyimide-based membrane transfer bonding technology", J. Micromech. Microeng., vol. 20, no. 9, p. 095027, 2010.
113. A. Lapadatu, G. Kittilsland, A. Elfving, E. Hohler, T. Kvisterøy, T. Bakke, and P. Ericsson, "High-performance long wave infrared bolometer fabricated by wafer bonding", in Proc. SPIE, 2010, vol. 7660, p. 766016.
114. T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. C. Jeong, Y. Ohara, A. Noriki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C.-K. Yin, K. Inamura, K.-W. Lee, J.-C. Bea, T. Tanaka, and M. Koyanagi, "New heterogeneous multi-chip module integration technology using self-assembly method", in Proc. Electron Devices Meet., 2008, pp. 1-4.
115. U. Srinivasan, M. A. Helmbrecht, C. Rembe, R. S. Muller, and R. T. Howe, "Fluidic self-assembly of micromirrors ontomicro actuators using capillary forces", IEEE J. Sel. Topics Quan. Electron., vol. 8, no. 1, pp. 4-11, Jan./Feb. 2002. (Pubitemid 34491547)
116. F. Niklaus, C. Jansson, A. Decharat, J.-E. Källhammer, H. Pettersson, and G. Stemme, "Uncooled infrared bolometer arrays operating in a low to medium vacuum atmosphere: Performance model and tradeoffs", in Proc. SPIE, Orlando, FL, vol. 6542, 2007, pp. 1M.1-1M.12.
117. N. Roxhed, F. Niklaus, A. C. Fischer, F. Forsberg, L. Höglund, P. Ericsson, B. Samel, S. Wissmar, A. Elfvingc, T. I. Simonsen, K. Wang, and N. Hoivik, "Low-cost uncooled microbolometers for thermal imaging", in Proc. SPIE, Brussels, Belgium, vol. 7726, 2010, p. 772611.
118. F. Niklaus, P. Enoksson, P. Griss, E. Kälvesten, and G. Stemme, "Low temperature wafer level transfer bonding", IEEE J. Microelectromech. Syst., vol. 10, no. 4, pp. 525-531, 2001.
119. J.-E. Källhammer, H. Pettersson, D. Eriksson, S. Junique, S. Savage, C. Vieider, J. Y. Andersson, F. Niklaus, and G. Stemme, "Fulfilling the pedestrian protection directive using a long-wavelength infrared camera designed to meet the performance and cost targets", in Proc. SPIE, Strasbourg, France, vol. 6198, 2006, pp. 74-84.
120. F. Niklaus, C. Vieider, and H. Jakobsen, "MEMS-based uncooled infrared bolometer arrays-A review", in Proc. SPIE, Beijing, China, vol. 6836, 2007, pp. 0D1-0D15.
121. F. Niklaus, A. Decharat, C. Jansson, and G. Stemme, " Performancemodel for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure", Infrared Phy. Technol., vol. 51, no. 3, pp. 168-177, 2008.
122. G. Roelkens, D. Van Thourhout, and R. Baets, "Heterogeneous integration of III-V membrane devices and ultracompact SOI waveguides", LEOS Summer Topicals, pp. 23-24, 2004.
123. G. Roelkens, J. Brouckaert, D. Taillaert, P. Dumon, W. Bogaerts, D. Van Thourhout, R. Baets, R. Nötzel, and M. Smit, "Integration of InP/InGaAsP photodetectors onto silicon-on-insulator waveguide circuits", Optics Exp., vol. 13, pp. 10102-10108, 2005. (Pubitemid 41785219)
124. G. Roelkens, D. Van Thourhout, and R. Baets, "Ultra-thin benzocyclobutene bonding of III-V dies onto SOI substrate", Electron. Lett., vol. 41, no. 9, pp. 561-562, 2005. (Pubitemid 40672646)
125. G. Roelkens, D. Van Thourhout, and R. Baets, "Coupling schemes for heterogeneous integration of III-V membrane devices and silicon-oninsulator waveguides", J. Lightw. Technol., vol. 23, no. 11, pp. 3827-3831, 2005. (Pubitemid 43066010)
126. I. Christiaens, G. Roelkens, K. De Mesel, D. Van Thourhout, and R. Baets, "Thin-film devices fabricated with benzocyclobutene adhesive wafer bonding", J. Lightw. Technol., vol. 23, pp. 517-523, May 2005. (Pubitemid 40414817)
127. G. Roelkens, J. Brouckaert, D. Van Thourhout, R. Baets, R. Nötzel, and M. Smit, "Adhesive bonding of InP/InGaAsP dies to processed siliconon insulator wafers using DVS-bis-benzocyclobutene", J. Electrochem. Soc., vol. 153, no. 12, pp. G1015-G1019, 2006. (Pubitemid 44711562)
128. G. Roelkens, J. Van Campenhout, J. Brouckaert, D. Van Thourhout, R. Baets, P. R. Romeo, P. Regreny, A. Kazmierczak, C. Seassal, X. Letartre, G. Hollinger, J. M. Fedeli, L. Di Cioccio, and C. Lagahe-Blanchard, "III-V/Si photonics by die-to-wafer bonding", Materials Today, vol. 10, no. 7-8, pp. 36-43, 2007. (Pubitemid 46907720)
129. F. Forsberg, N. Roxhed, G. Stemme, and F. Niklaus, "Heterogeneous integration technology for combination of different wafer sizes using an expandable handle substrate", in Proc. IEEE MEMS, Cancun, Mexico, 2011.
130. D. Clausi, H. Gradin, S. Braun, J. Peirs, G. Stemme, D. Reynaerts, and W. van der Wijngaart, "Design and wafer-level fabrication of SMA wire microactuators on silicon", J. Microelectromech. Syst., vol. 19, no. 4, pp. 982-991, 2010.
131. A. C. Fischer, H. Gradin, S. Braun, S. Schröder, G. Stemme, and F. Niklaus, "Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology", in Proc. IEEE MEMS, Cancun, Mexico, 2011.
132. C.-L. Wong, M. Annamalai, Z.-Q. Wang, and M. Palaniapan, "Characterization of nanomechanical graphene drum structures", J. Micromech. Microeng., vol. 20, pp. 115029, 2010.
133. J. S. Bunch, A. M. van der Zande, S. S. Verbridge, I. W. Frank, D. M. Tanenbaum, J. M. Parpia, H. G. Craighead, and P. L. McEuen, " Electromechanical resonators from graphene sheets", Science, vol. 315, pp. 490-493, 2007. (Pubitemid 46178391)
134. J. T. Robinson, M. Zalalutdinov, J. W. Baldwin, E. S. Snow, Z. Wei, P. Sheehan, and B. H. Houston, "Wafer-scale reduced graphene oxide films for nanomechanical devices", Nano Lett., vol. 8, pp. 3441-3445, 2008.
135. (2010, May 18). Top 20 MEMS foundries. i-Micronews, Yole Development [Online]. Available: http://www.i-micronews.com