Technology of hybrid integration of silicon MEMS and CMOS structures using polymer

Smart Systems Integration 2008 - 2nd European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2008

Volumn , Issue , 2008, Pages

  Janus, P ^a   Grabiec, P ^a   Domanski K ^a   Kociubinski, A ^a   Szmigiel, D ^a  

^a Department of Micro and Nanotechnology of Wide Bandgap Semiconductors   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 85060354571     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. P. Grabiec, P. Janus, K. Domański, W. Milczarek, Method of integration multichip microsystems, patent application P 375716, Poland 2005
2. A. Modafe, N. Ghalichechian, M. Powers, M. Khbeis, R. Ghodssi, Embedded benzocyclobutene in silicon: An integrated fabrication process for electrical and thermal isolation in MEMS, Microelectronic Eng., 82 (2005) 154–167
3. DWL 200 Heidelberg Instruments – www.himt.de
4. INTEGRAMplus Project Service Offer – www.integramplus.com
5. Healthy Aims project - www.healthyaims.org