Batch Transfer Integration of RF Microrelays

IEEE Microwave and Guided Wave Letters

Volumn 10, Issue 8, 2000, Pages 313-315

  Milanovic, Veljko ^a   Maharbiz, Michel ^a   Pister, Kristofer S J ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Batch transfer; flip chip bonding; microelectromechanical systems; RF MEMs; RF switch

Indexed keywords

BATCH TRANSFER INTEGRATION; MICRORELAYS;

ELECTRIC CONTACTS; ELECTRIC RELAYS; FLIP CHIP DEVICES;

MICROELECTROMECHANICAL DEVICES;

EID: 0034239368     PISSN: 10518207     EISSN: None     Source Type: Journal    
DOI: 10.1109/75.862225     Document Type: Article

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