A novel die to wafer (D2W) collective bonding method for MEMS and electronics heterogeneous 3D integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 829-833

  Choi, Won Kyoung ^a   Premachandran, C S ^a   Xie, Ling ^a   Ong, Siong Chiew ^a   He, Johnny Han ^a   Yap, Guan Jie ^a   Yu, Aibin ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ALIGNMENT TOLERANCE; BEAM STRUCTURES; BEFORE AND AFTER; BONDING METHODS; BONDING TIME; ELECTRICAL RESISTANCES; FLIP-CHIP BONDERS; LOW TEMPERATURES; MEMSDEVICES; NON-FUNCTIONAL; PACKAGE DESIGNS; PAD SIZES; PARASITIC EFFECT; PICK-AND-PLACE MACHINES; WAFER BONDERS;

BONDING; ELECTRIC POWER SUPPLIES TO APPARATUS;

WAFER BONDING;

EID: 77955203723     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490721     Document Type: Conference Paper

References (9)

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