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Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2002, Pages 137-140

A direct plasma etch approach to high aspect ratio polymer micromachining with applications in biomems and CMOS-MEMS

(3) Zahn, Jeffrey D a,c Gabriel, Kaigham J b,c Fedder, Gary K b,c

a PENNSYLVANIA STATE UNIVERSITY (United States)

b CARNEGIE MELLON UNIVERSITY (United States)

c CARNEGIE MELLON UNIVERSITY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; CMOS INTEGRATED CIRCUITS; MECHANICAL PROPERTIES; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MICROSTRUCTURE; MOLECULAR STRUCTURE; OXYGEN; PASSIVATION; PLASMA ETCHING; POLYMERIC MEMBRANES; SEMICONDUCTING SILICON;

ETCHANT GAS; HIGH ASPECT RATIO POLYMER; INTEGRATED FLUIDIC CONDUITS; MICROELECTROMECHANICAL SYSTEMS; SWITCHING CHEMISTRY;

POLYMETHYL METHACRYLATES;

EID: 0036195494 PISSN: 10846999 EISSN: None Source Type: Journal
DOI: 10.1109/MEMSYS.2002.984223 Document Type: Article

Times cited : (12)

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