A bulk acoustic wave (BAW) based transceiver for an in-tire-pressure monitoring sensor node

IEEE Journal of Solid-State Circuits

Volumn 45, Issue 1, 2010, Pages 167-177

  Flatscher, Martin ^a   Dielacher, Markus ^a   Herndl, Thomas ^a   Lentsch, Thomas ^a   Matischek, Rainer ^a   Prainsack, Josef ^a   Pribyl, Wolfgang ^b   Theuss, Horst ^c   Weber, Werner ^d  

^a INFINEON TECHNOLOGIES AUSTRIA AG   (Austria)

^b GRAZ UNIVERSITY OF TECHNOLOGY   (Austria)

^c Infineon   (Germany)

^d INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Bulk acoustic wave (BAW); Chip stack; Low noise amplifier (LNA); Matching network; Oscillator; Power amplifier; Resonator; Transceiver

Indexed keywords

BULK ACOUSTIC WAVES; LOW NOISE AMPLIFIER (LNA); MATCHING NETWORK; MATCHING NETWORKS; OSCILLATOR;

ACOUSTIC WAVES; ACOUSTICS; ANTENNAS; APPLICATION SPECIFIC INTEGRATED CIRCUITS; AUDIO FREQUENCY AMPLIFIERS; BIT ERROR RATE; CRYSTAL OSCILLATORS; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTRIC POWER TRANSMISSION NETWORKS; LOW NOISE AMPLIFIERS; POWER AMPLIFIERS; RESONATORS; SENSOR NODES; SENSORS; TIRES;

TRANSCEIVERS;

EID: 73249141924     PISSN: 00189200     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSSC.2009.2034436     Document Type: Conference Paper

References (14)

1. J. Polastre, J. Hill, and D. Culler, "Versatile low power media access for wireless sensor networks," in SenSys'04: Proc. 2nd Int. Conf. Embedded Networked Sensor Systems, New York, NY, USA, 2004, pp. 95-107, ACM.
2. B. Otis, Y. Chee, R. Lu, N. Pletcher, and J. Rabaey, "An ultra-low power mems-based two-channel transceiver for wireless sensor networks," in Symp. VLSI Circuits Dig. Tech. Papers 2004, Jun. 2004, pp. 20-23.
3. F. Roozeboom, M. A. Blauw, Y. Lamy, E. van Grunsven, W. Dekkers, J. F. Verhoeven, E. F. van den Heuvel, E. van der Drift, E. W. Kessels, and R. M. van de Sanden, "Deep reactive ion etching of through silcion vias," in Handbook of 3-D Integration: Technology and Applications of 3-D Integrated Circuits, P. Ramm, C. Bower, and P. Garrou, Eds. New York: Wiley-VCH, 2008, vol.1, pp. 47-92.
4. A. Klumpp, R. Wieland, R. Ecke, and S. E. Schulz, "Metallization by chemical vapour deposition of w and cu," in Handbook of 3-D Integration: Technology and Applications of 3-D Integrated Circuits, P. Ramm, C. Bower, and P. Garrou, Eds. New York:Wiley-VCH, 2008, vol.1, pp. 157-164.
5. R. Wieland, "Sio2," in Handbook of 3-D Integration: Technology and Applications of 3-D Integrated Circuits, P. Ramm, C. Bower, and P. Garrou, Eds. New York: Wiley-VCH, 2008, vol.1, pp. 107-120, DRAFT 11.
6. P. Ramm and A. Klumpp, "Through-silicon via technologies for extreme miniaturized 3d integrated wireless sensor systems (e-cubes)," in Proc. Int. Interconnect Technology Conf., IITC 2008, Jun. 2008, pp. 7-9.
7. P. Ramm, A. Klumpp, J. Weber, and M. Taklo, "3d integration technologies," in Symp. Design, Test, Integration & Packaging of MEMS/MOEMS, 2009, Apr. 2009, pp. 71-73.
8. E. Beyne, "3d integration technologies at imec," in Handbook of 3-D Integration: Technology and Applications of 3-D Integrated Circuits, P. Ramm, C. Bower, and P. Garrou, Eds. New York: Wiley-VCH, 2008, vol.2, pp. 413-430.
9. M. Taklo, N. Lietaer, H. Tofteberg, T. Seppanen, J. Prainsack, J.Weber, and P. Ramm, "3d mems and ic integration," in Material Research Society Symp. Proc., 2008, vol.1112.
10. M. Taklo, N. Lietaer, H. Tofteberg, T. Seppanen, P. Ramm, and W. Weber, "3d stacked mems and ics in a miniaturized sensor node," in Symp. Design, Test, Integration&Packaging of MEMS/MOEMS, 2009, Apr. 2009, pp. 74-77.
11. R. Aigner, "High performance rf-filters suitable for above ic integration: film bulk-acoustic- resonators (fbar) on silicon," in Proc. IEEE Custom Integrated Circuits Conf., CICC 2003, Sep. 2003, pp. 141-146.
12. J. Chabloz, D. Ruffieux, A. Vouilloz, P. Tortori, F. Pengg, C. Muller, and C. Enz, "Frequency synthesis for a low-power 2.4 ghz receiver using a baw oscillator and a relaxation oscillator," in Proc. 33rd European Solid State Circuits Conf., ESSCIRC 2007, Sep. 2007, pp. 492-495.
13. J. Chabloz, C. Muller, F. Pengg, A. Pezous, C. Enz, and M.-A. Dubois, "A low-power 2.4 ghz cmos receiver front-end using baw resonators," in IEEE Int. Solid-State Circuits Conf. (ISSCC 2006) Dig. Tech. Papers, Feb. 2006, pp. 1244-1253.
14. M. Dielacher, M. Flatscher, and W. Pribyl, "A low noise amplifier with on-chip matching network and integrated bulk acoustic wave resonators for high image rejection," Research in Microelectronics and Electronics, 2009. PRIME 2009, pp. 172-175, Jul. 2009.