Flip-chip packaging of piezoresistive barometric pressure sensors

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 8763, Issue , 2013, Pages

  Waber, T ^a   Pahl, W ^b   Schmidt, M ^b   Feiertag, G ^a   Stufler, S ^b   Dudek, R ^c   Leidl, A ^b  

^a MUNICH UNIVERSITY OF APPLIED SCIENCES   (Germany)

^b EPCOS AG   (Germany)

^c FRAUNHOFER INSTITUTE FOR ELECTRONIC NANO SYSTEMS ENAS   (Germany)

Author keywords

Flip chip packaging; Piezoresistive barometric pressure sensors; Temperature hysteresis

Indexed keywords

ALUMINUM METALLIZATION; BAROMETRIC PRESSURE; COEFFICIENTS OF THERMAL EXPANSIONS; FLIP-CHIP PACKAGING; PACKAGING TECHNOLOGIES; PIEZORESISTIVE PRESSURE SENSORS; TEMPERATURE HYSTERESIS; UNDER BUMP METALLIZATION;

ACTUATORS; ATMOSPHERIC PRESSURE; BAROMETERS; COPPER; FLIP CHIP DEVICES; HYSTERESIS; PRESSURE SENSORS; SILICON WAFERS; SMART SENSORS; STRESSES; THERMAL EXPANSION; WAFER BONDING;

CHIP SCALE PACKAGES;

EID: 84881179069     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.2016459     Document Type: Conference Paper

References (5)

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