Nanoelectromechanical digital logic circuits using curved cantilever switches with amorphous-carbon-coated contacts

Solid-State Electronics

Volumn 113, Issue , 2015, Pages 157-166

  Ayala, Christopher L ^a   Grogg, Daniel ^b   Bazigos, Antonios ^c   Bleiker, Simon J ^d   Fernandez Bolaños, Montserrat ^c   Niklaus, Frank ^d   Hagleitner, Christoph ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

^b TE Connectivity   (Switzerland)

^c EPFL   (Switzerland)

^d ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Amorphous carbon; Curved cantilever; Digital logic design; NEMS; Ring oscillator; VLSI

Indexed keywords

AMORPHOUS CARBON; CARBON; NANOCANTILEVERS; NEMS; OSCILLATORS (ELECTRONIC); VLSI CIRCUITS;

AMORPHOUS CARBON (A-C); AMORPHOUS CARBON-COATED; CURVED CANTILEVER; DIGITAL LOGIC CIRCUIT; DIGITAL LOGIC DESIGN; NANO-ELECTROMECHANICAL; RING OSCILLATOR; VLSI;

LOGIC CIRCUITS;

EID: 84937250804     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sse.2015.05.029     Document Type: Article

References (30)

1. International technology roadmap for semiconductors; 2013. < http://www.itrs.net >.
2. D. Nikonov, and I. Young Overview of beyond-CMOS devices and a uniform methodology for their benchmarking Proc IEEE 101 12 2013 2498 2533
3. Y. Pu, Y. He, Z. Ye, S. Londono, A. Abbo, R. Kleihorst, and et al. From Xetal-II to Xetal-Pro: on the road toward an ultralow-energy and high-throughput SIMD processor IEEE Trans Circ Syst Video Technol 21 4 2011 472 484 10.1109/TCSVT.2011.2125590
4. A.W. Knoll, D. Grogg, M. Despont, and U. Duerig Fundamental scaling properties of electro-mechanical switches New J Phys 14 12 2012 84 < http://stacks.iop.org/1367-2630/14/i=12/a=123007 >
5. O.Y. Loh, and H.D. Espinosa Nanoelectromechanical contact switches Nat Nanotechnol 7 5 2012 283 295 < http://dx.doi.org/10.1038/nnano.2012.40 >
6. B.W. Soon, E. Ng, V. Hong, Y. Yang, C.H. Ahn, Y. Qian, and et al. Fabrication and characterization of a vacuum encapsulated curved beam switch for harsh environment application J Microelectromech Syst 23 5 2014 1121 1130
7. J. Fujiki, N. Xu, L. Hutin, I.-R. Chen, C. Qian, and T.-J.K. Liu Microelectromechanical relay and logic circuit design for zero crowbar current IEEE Trans Electron Dev 61 9 2014 3296 3302
8. Tang BZ, Bhave SA, Manohar R. Low power asynchronous VLSI with NEM relays. In: 2014 20th IEEE international symposium on asynchronous circuits and systems (ASYNC); 2014. p. 85-92. http://dx.doi.org/10.1109/ASYNC.2014.19.
9. J.O. Lee, Y.-H. Song, M.-W. Kim, M.-H. Kang, J.-S. Oh, H.-H. Yang, and et al. A sub-1-V nanoelectromechanical switching device Nat Nanotechnol 8 1 2013 36 40. U 10.1038/nnano.2012.208
10. D. Lee, W. Lee, C. Chen, F. Fallah, J. Provine, S. Chong, and et al. Combinational logic design using six-terminal NEM relays IEEE Trans Comput-Aided Des Integr Circ Syst 32 5 2013 653 666 10.1109/TCAD.2012.2232707
11. Chen IR, Chen Y, Hutin L, Pott V, Nathanael R, Liu TJK. Stable ruthenium-contact relay technology for low-power logic. In: 2013 Transducers Eurosensors XXVII: the 17th international conference on solid-state sensors, actuators and microsystems (TRANSDUCERS EUROSENSORS XXVII); 2013. p. 896-9. http://dx.doi.org/10.1109/Transducers.2013.6626912.
12. Y. Chen, R. Nathanael, J. Yaung, L. Hutin, and T.-J. King Liu Reliability of MEM relays for zero leakage logic Proc SPIE 8614 2013 10.1117/12.2005719 861404-861404-7
13. Fariborzi H, Chen F, Nathanael R, Chen IR, Hutin L, Lee R, et al. Relays do not leak - CMOS does. In: 2013 50th ACM/EDAC/IEEE design automation conference (DAC); 2013. p. 1-4.
14. Kam H, Chen Y, Liu TJK. Reliable micro-electro-mechanical (MEM) switch design for ultra-low-power logic. In: 2013 IEEE international reliability physics symposium (IRPS); 2013. p. 6A.1.1-6A.1.5. http://dx.doi.org/10.1109/IRPS.2013.6532044.
15. T.-J.K. Liu, L. Hutin, I.-R. Chen, R. Nathanael, Y. Chen, M. Spencer, and et al. Recent progress and challenges for relay logic switch technology IEEE symposium on VLSI technology 2012 IEEE Honolulu, Hawai 43 44
16. Munoz-Gamarra J, Barniol N, Juillard J. Analysis of a MEMS-based ring oscillator. In: 2012 IEEE international symposium on circuits and systems (ISCAS); 2012. p. 2103-6.
17. J. Jeon, L. Hutin, R. Jevtic, N. Liu, Y. Chen, R. Nathanael, and et al. Multiple-input relay design for more compact implementation of digital logic circuits IEEE Electron Dev Lett 33 2 2012 281 283
18. M. Spencer, F. Chen, C.C. Wang, R. Nathanael, H. Fariborzi, A. Gupta, and et al. Demonstration of integrated micro-electro-mechanical relay circuits for VLSI applications IEEE J Solid-State Circ 46 1 2011 308 320 10.1109/JSSC.2010.2074370
19. Fariborzi H, Chen F, Stojanovic V, Nathanael R, Jeon J, Liu TJK. Design and demonstration of micro-electro-mechanical relay multipliers. In: Proc. IEEE asian solid state circuits conf (A-SSCC); 2011. p. 117-20. http://dx.doi.org/10.1109/ASSCC.2011.6123618.
20. D. Grogg, U. Drechsler, A. Knoll, U. Duerig, Y. Pu, C. Hagleitner, and et al. Curved in-plane electromechanical relay for low power logic applications J Micromech Microeng 23 2013 8 < http://stacks.iop.org/0960-1317/23/i=2/a=025024 >
21. Grogg D, Ayala C, Drechsler U, Sebastian A, Koelmans W, Bleiker S, et al. Amorphous carbon active contact layer for reliable nanoelectromechanical switches. In: 2014 IEEE 27th international conference on micro electro mechanical systems (MEMS); 2014. p. 143-6.
22. F. Zimmer, M. Lapisa, T. Bakke, M. Bring, G. Stemme, and F. Niklaus One-megapixel monocrystalline-silicon micromirror array on CMOS driving electronics manufactured with very large-scale heterogeneous integration J Microelectromech Syst 20 3 2011 564 572
23. M. Lapisa, G. Stemme, and F. Niklaus Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS IEEE J Select Top Quant Electron 17 3 2011 629 644
24. F. Forsberg, A. Lapadatu, G. Kittilsland, S. Martinsen, N. Roxhed, A. Fischer, and et al. CMOS-integrated Si/SiGe quantum-well infrared microbolometer focal plane arrays manufactured with very large-scale heterogeneous 3-d integration IEEE J Select Top Quant Electron 21 4 2015 1 11
25. S.-M. Kang, and Y. Leblebici Dynamic logic circuits CMOS digital integrated circuits: analysis and design 3rd ed. 2003 McGraw-Hill [ch. 9]
26. A.B. Kahng, J. Lienig, I.L. Markov, and J. Hu Timing closure VLSI physical design: from graph partitioning to timing closure 2011 Springer
27. S. Rana, Q. Tian, A. Bazigos, D. Grogg, M. Despont, C. Ayala, and et al. Energy and latency optimization in NEM relay-based digital circuits IEEE Trans Circ Syst I: Regul Papers 61 8 2014 2348 2359
28. A. Bazigos, C. Ayala, M. Fernandez-Bolanos, Y. Pu, D. Grogg, C. Hagleitner, and et al. Analytical compact model in Verilog-A for electrostatically actuated ohmic switches IEEE Trans Electron Dev 61 6 2014 2186 2194
29. M.-A. Chalkiadaki, C. Valla, F. Poullet, and M. Bucher Why- and how- to integrate Verilog-A compact models in SPICE simulators Int J Circ Theor Appl 41 11 2013 1203 1211 10.1002/cta.1833
30. A. Bazigos, C.L. Ayala, S. Rana, D. Grogg, M. Fernandez-Bolaos, C. Hagleitner, and et al. Electromechanical design space exploration for electrostatically actuated ohmic switches using extended parallel plate compact model Solid-State Electron 99 0 2014 93 100 10.1016/j.sse.2014.06.030 < http://www.sciencedirect.com/science/article/pii/S0038110114001634 >