Miniaturised sensor node for tire pressure monitoring (e-CUBES)

Advanced Microsystems for Automotive Applications 2009: Smart Systems for Safety, Sustainability, and Comfort

Volumn , Issue , 2009, Pages 313-331

  Schjolberg Henriksen K ^a   Taklo, M M V ^a   Lietaer, N ^a   Prainsack, J ^b   Dielacher, M ^b   Klein, M ^c   Wolf, M J ^c   Weber, J ^c   Ramm, P ^c   Seppanen T ^d  

^a SINTEF   (Norway)

^b INFINEON TECHNOLOGIES AUSTRIA AG   (Austria)

^c Fraunhofer Institute Reliability and Microintegration   (Germany)

^d Infineon Technologies SensoNor AS   (Norway)

Author keywords

3D integration; MEMS; Through silicon via; Tire pressure monitoring system

Indexed keywords

3-D INTEGRATION; BULK ACOUSTIC RESONATORS; ELECTRICAL RESISTANCES; INTERCONNECT DEVICES; THROUGH-SILICON VIA; THROUGH-SILICON VIA (TSV) TECHNOLOGIES; TIRE PRESSURE MONITORING; TIRE-PRESSURE MONITORING SYSTEMS;

AUTOMOBILES; BOND STRENGTH (MATERIALS); MEMS; MICROSYSTEMS; SENSOR NODES; SUSTAINABLE DEVELOPMENT; THREE DIMENSIONAL; TRANSCEIVERS;

PRESSURE SENSORS;

EID: 84884293891     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1007/978-3-642-00745-3_21     Document Type: Conference Paper

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