Chip-last embedded actives and passives in thin organic package for 1-110 GHz multi-band applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 758-763

  Liu, Fuhan ^a   Sundaram, Venky ^a   Min, Sunghwan ^a   Sridharan, Vivek ^a   Chan, Hunter ^a   Kumbhat, Nitesh ^a   Lee, Baik Woo ^a   Tummala, Rao ^a   Baars, Dirk ^b   Kennedy, Scott ^b   Paul, Sankar ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Rogers Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D ICS; CONDUCTIVE LAYER; D-MODULES; DEEP CAVITY; EMBEDDED ACTIVE; FULLY COMPATIBLE; INTERCONNECT TECHNOLOGY; LOW LOSS; MANUFACTURING PROCESS; MATERIAL SYSTEMS; MEMSDEVICES; METAL LAYER; MILLIMETER-WAVE APPLICATIONS; MULTIBAND; ORGANIC DIELECTRICS; ORGANIC PACKAGES; ORGANIC SUBSTRATE; PASSIVE COMPONENTS; POLYMER ADHESIVES; RELIABILITY TESTING; THERMOSETTING POLYMERS; ULTRA FINE PITCH; ULTRA-THIN CHIPS; ULTRATHIN SILICON;

INDUSTRIAL ENGINEERING; ORGANIC POLYMERS; POLYMERS; PRODUCTION ENGINEERING; SHOCK TESTING; TECHNOLOGY; THERMOSETS; THREE DIMENSIONAL;

SUBSTRATES;

EID: 77955199522     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490757     Document Type: Conference Paper

References (8)

1. Yann Guillou, "3D Integration for wireless products: An industrial perspective", i-Micronews, June 2009. http://www.i-micronews.com
2. 2. T. Yamano, M. Sunohara, H. Izuka, T. Koyama, "Wiring board with embedded semiconductor chip, embedded reinforcing member and method of manufacturing the same", European Patent # EP1703558, 2006.
3. F. Liu, V. Sundaram, H. Chan, G. Krishnan, J. Shang, J. Dobrick, J. Neill, D. Baars, S. Kennedy, and R.R. Tummala, "Ultra-High Density, Thin Core and Low Loss Organic System-on-Package (SOP) Substrate Technology for Mobile Applications", Proceedings of the 59th ECTC, San Diego, CA, May 2009.
4. S. Hwang, S. Min, M. Swaminathan, V. Venkatakrishnan, H. Chan, F. Liu, V. Sundaram, S. Kennedy, D. Baars, B. Lacroix, Y. Li, J. Papapolymerou, , "Characterization of Next Generation Thin Low-K and Low-Loss Organic Dielectrics From 1 to 110 GHz.", IEEE Transactions on Advanced Packaging, 2008.
5. R. R. Tummala, M. Swaminathan, Introduction to System-on-Package (SOP), McGraw-Hill (New York, 2008).
6. Baik-Woo Lee, Venky Sundaram, Boyd Wiedenman, Chong K Yoon, Mahadevan Iyer and Rao R Tummala, "Chip-last Embedded Active for System-On-Package (SOP)", Electronic Components and Technology Conference, Reno, May 2007.
7. N. Kumbhat, M. Raine, G. Mehrotra, A. Choudhury, P. M. Raj, R. Zhang, K. S. Moon, V. Sundaram, G. Meyer-Berg, CP Wong, and Rao Tummala, "Highly-Reliable, 30μm Pitch Copper Interconnects using nano-ACF/NCF", ECTC 2009.
8. Min, Sunghwan; Hwang, Seunghyun; Chung, Daehyun; Swaminathan, Madhavan; Sridharan, Vivek; Chan, Hunter; Fuhan Liu; Sundaram, Venky; Tummala, Rao R.; "Filter integration in ultra thin organic substrate via 3D stitched capacitor," Proc Electrical Design of Advanced Packaging & Systems Symposium, Dec. 2009, pp. 1 - 4.