Challenges in the packaging of MEMS

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 41-47

  O'Neal, C B ^a   Malshe, A P ^a   Singh, S B ^a   Brown, W D ^a   Eaton, W P ^b  

^a UNIVERSITY OF ARKANSAS   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACES (MATERIALS); PACKAGING MATERIALS;

APPLICATION SPECIFIC; FLUID MASS FLOW; HARSH ENVIRONMENT; INTERFACIAL STRESS; MEMS PACKAGES; MEMS PACKAGING; PHYSICAL INTERFACE; RESEARCH AND DEVELOPMENT;

PACKAGING;

EID: 84984961482     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757284     Document Type: Conference Paper

References (16)

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