Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs

Sensors and Actuators, A: Physical

Volumn 154, Issue 1, 2009, Pages 180-186

  Niklaus, Frank ^a   Decharat, Adit ^a   Forsberg, Fredrik ^a   Roxhed, Niclas ^a   Lapisa, Martin ^a   Populin, Michael ^a   Zimmer, Fabian ^b   Lemm, Jörn ^b   Stemme, Göran ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS   (Germany)

Author keywords

3D IC MEMS integration; Adhesive wafer bonding; Nano imprint resist; Polymer; Silicon on integrated circuit; SOIC

Indexed keywords

3-D INTEGRATION; 3D IC MEMS INTEGRATION; ADHESIVE BONDING; ADHESIVE WAFER BONDING; BOLOMETER ARRAY; BONDED WAFERS; IC WAFERS; IN-BETWEEN; INERTIAL SENSOR; INTEGRATED MEMS; MEMBRANE STRUCTURES; MICROELECTROMECHANICAL SYSTEMS; MICROMIRROR ARRAY; NANO-IMPRINT; NANO-IMPRINT RESIST; POLYMER ADHESIVES; SACRIFICIAL MATERIAL; SOIC; THREE DIMENSIONAL (3D) INTEGRATION; VOID-FREE; WAFER BONDING PROCESS; WAFER TO WAFER BONDING;

ADHESIVES; COMPOSITE MICROMECHANICS; FLEXIBLE STRUCTURES; INTEGRATED CIRCUITS; MEMS; MICROELECTROMECHANICAL DEVICES; NANOSENSORS; POLYMERS; SILICON WAFERS; THERMOSETS; THREE DIMENSIONAL;

WAFER BONDING;

EID: 68849118449     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2009.07.009     Document Type: Article

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