Plastic molded package technology for MEMS sensor evolution of MEMS sensor package

2014 International Conference on Electronics Packaging, ICEP 2014

Volumn , Issue , 2014, Pages 371-375

  Oouchi, Atsushi ^a  

^a STMICROELECTRONICS   (Italy)

Author keywords

Accelerometer; Gyroscope; Magnetometer; MEMS; Plastic mold; Pressure sensor; Smart sensor; Stacked package

Indexed keywords

ACCELEROMETERS; CONSUMER PRODUCTS; ELECTRONICS PACKAGING; GYROSCOPES; MAGNETOMETERS; MEMS; PLASTIC MOLDS; PRESSURE SENSORS; SMART SENSORS;

ELECTRONIC DEVICE; HIGHER INTEGRATION; MEMS PACKAGES; MOBILE TERMINAL; NEW APPLICATIONS; PACKAGE TECHNOLOGIES; STACKED PACKAGE; TECHNOLOGY ELEMENT;

SENSORS;

EID: 84903716544     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEP.2014.6826711     Document Type: Conference Paper

References (2)

1. B. Vigna, "More than Moore: micro-machined products enable new applications and open new markets", Invited Talk, IEDM 2005, Washington D.C. Dec 2005
2. EDN innovation award 2003; http://staging.edn.com/design/sensors/4329230/ Newton-s-chips-low-gaccelerometer-Ics