Wafer level packaging of MEMS

Journal of Micromechanics and Microengineering

Volumn 18, Issue 7, 2008, Pages

  Esashi, Masayoshi ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; ELECTRONIC EQUIPMENT MANUFACTURE; ETCHING; GLASS; GLASS BONDING; INTERCONNECTION NETWORKS; MACHINING; MELTING POINT; MEMS; METALS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; NONMETALS; SILICON; SILICON WAFERS; SMELTING; SURFACE MICROMACHINING; SURFACES; THERMOCHEMISTRY; WAFER BONDING;

ANODIC BONDING (AD); BONDED WAFERS; ELECTRICAL FEEDTHROUGH; ELECTRICAL INTERCONNECTIONS; LOW MELTING POINT; MELTING MATERIALS; METAL-TO-METAL BONDING; MICRO ELECTRO MECHANICAL SYSTEMS (MEMS); SILICON CHIPS; VACUUM PACKAGING; WAFER LEVEL PACKAGE (WLP);

ELECTRONICS PACKAGING;

EID: 47249096960     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/7/073001     Document Type: Article

References (89)

1. Esashi M 1994 Encapsulated micro mechanical sensors Microsyst. Technol. 1 2-9
2. Najafi K, Harpster T J, Kim H, Mitchell J S and Welch W C 2007 Wafer bonding Comprehensive Microsystems vol 1 ed Y B Gianchandani, O Tabata and H Zappe (Amsterdam: Elsevier) pp 235-70
3. Roylance L M and Angell J B 1979 A batch-fabricated silicon accelerometer IEEE Trans. Electron Dev. ED-26 1911-7
4. Schmitt J M, Mihm F G and Mindle J D 1986 New methods for whole blood oximetry Ann. Biomed. Eng. 14 35-52
5. 2 laser-drilled vias through glass Micromachining and Micropackaging of Transducers ed C D Fung, P W Cheung, W H Ko and D G Fleming (Amsterdam: Elsevier) pp 79-84
6. Esashi M, Matsumoto Y and Shoji S 1990 Absolute pressure sensors by air-tight electrical feedthrough structure Sensors Actuators A 21-A23 1048-52
7. Kudoh T, Shoji S and Esashi M 1991 An integrated miniature capacitive pressure sensor Sensors Actuators A 29 185-93
8. Shirai M and Esashi M 1992 Circuit damage by anodic bonding Sensor Technical Report (ST-92-7) (Tokyo: Institute of Electrical Engineers of Japan) pp 9-17 (in Japanese)
9. Esashi M 1993 Micromachining for packaged sensors Dig. of Tech. Papers, Transducers '93 (Yokohama, Japan) pp 260-5
10. Mochida Y, Kato Y, Kaneko Y, Mori A, Kobayshi M and Kobayashi 2007 Precise MEMS gyroscope with ladder structure Dig. of Tech. Papers, Transducers '07 (Lion, France) pp 2529-32
11. Lim G, Baek G and Esashi M 1998 A new bulk-micromachining using deep RIE and wet etching for an accelerometer Trans. Inst. Electr. Eng. Japan 118-E 420-4
12. Ko S, Sim D and Esashi M 1999 An electrostatic servo-accelerometer with mG resolution Trans. Inst. Electr. Eng. Japan 119-E 368-73
13. Liu Y, Li X, Abe T, Haga Y and Esashi M 2001 A thermomechanical relay with microspring contact array Proc. MEMS 2001 (Interlaken, Switzerland) pp 220-3
14. Nakamura K et al 2004 Development of RF MEMS switch Advantest Technical Report vol 22 pp 9-16 (in Japanese)
15. Ruby R C, Barfknecht A, Han C, Desai Y, Geefay F, Gan G, Gat M and Verhoeven T 2002 High-Q FBAR filters in a wafer-level chip-scale package 2002 IEEE Int. Solid-State Circuit Conf. pp 184-5
16. Shao H, Kumar D, Feld S A and Lear K L 2005 Fabrication of a Fabry-Perot cavity in a microfluidic channel using thermocompressive gold bonding of glass substrates J. Microelectromech. Syst. 14 756-62
17. Decharat A, Boers M, Niklaus F and Stemme G 2007 Novel room-temperature wafer-to-wafer attachment and sealing of cavities using cold metal welding Tech. Dig. MEMS (Kobe, Japan) pp 385-8
18. Yun C H, Martin J R, Tarvin E B and Winbigler 2008 Al to Al wafer bonding for MEMS encapsulation and 3-D interconnect MEMS2008 Tech. Dig. (Tucson, AZ, USA) pp 810-3
19. Chen K-N, Lee S H, Andry P S, Tsang C K, Topol A W, Lin Y-M, Lu J-Q, Young A M, Ieong M and Haensch W 2006 Structure, design and process control for Cu bonded interconnects in 3D integrated circuits IEDM Tech. Dig. (San Francisco, CA, USA) pp 367-70
20. Okada H, Itoh T, Fromel J, Gessner T and Suga T 2005 Room temperature vacuum sealing using surface activated bonding with Au thin films Dig. of Tech. Papers, Transducers '05 (Seoul, Korea) pp 932-5
21. Farrens S N, Dekker J R, Smith J K and Roberds B E 1995 Chemical free room temperature wafer to wafer direct bonding J. Electrochem. Soc. 142 3949-55
22. Takegawa Y, Baba T, Okudo T and Suzuki Y 2007 Wafer-level packaging for micro-electro-mechanical systems using surface activated bonding Japan. J. Appl. Phys. 46 2768-70
23. Ogihara M et al 2006 LED array integrated with Si driving circuits for LED printer printhead Electron. Lett. 42 881-882
24. Honma M, Minami K and Esashi M 1996 Face-down bonding with sealed cavity for micromechanical device packaging Sensors Mater. 8 23-31
25. Kim H and Najafi K 2005 Characterization of low- temperature wafer bonding using thin-film Parylene J. Microelectromech. Syst. 14 1347-55
26. Yuki T, Kuypers J H, Tanaka S and Esashi M 2007 Capacitive RF switch fabricated by low-temperature surface process and packaged using dry film resist Proc. 24th Sensors Symp. (Tokyo, Japan) pp 37-40
27. Sato N, Ishii H, Shigematsu S, Morimura H, Kudou K, Yano M and Machida K 2002 STP sealing technique for surface micromachined MEMS stacked on a CMOS LSI Extended Abstracts of the 2002 Int. Conf. on Solid State Devices and Materials (Nagoya, Japan) pp 320-1
28. Machida K, Kyuragi H, Akiya H, Imai K, Tounai A and Nakashima N 1998 Novel global planarization technology for interlayer dielectrics using spin on glass film transfer and hot pressing J. Vac. Sci. Technol. B 16 1093-7
29. Judy M W 2004 Evolution of integrated inertial MEMS technology, Solid-State Sensors Actuator and Microsystems Workshop (Hilton Head, SC, USA) pp 27-32
30. Chang Y-T, Hsu W-T, Najafi K and Nguyen C T-C 2002 Vacuum packaging technology using localized aluminum/silicon-to-glass bonding J. Microelectromech. Syst. 11 556-65
31. Chiao M and Lin L 2001 Hermetic wafer bonding based on rapid thermal processing Sensors Actuators A 91 398-402
32. Nguyen H, Bejhed J, Kohler J and Thornell G 2006 A solder sealing method for paraffin-filled microcavities J. Micromech. Microeng. 16 2369-74
33. Welch W and Njafi K 2008 Gold-indium transient liquid phase (TLP) wafer bonding for MEMS vacuum packaging MEMS2008 Tech. Dig. (Tucson, AZ, USA) pp 806-9
34. Welch W and Najafi K 2007 Nickel-tin transient liquid phase (TLP) wafer bonding for MEMS vacuum packaging Dig. of Tech. Papers, Transducers '07 (Lion, France) pp 1327-8
35. Klumpp A, Merkel R, Weber J, Wieland R, Elst G and Ramm P 2004 Vertical system integration technology for high speed applications by using inter-chip vias and solid-liquid interdiffusion bonding The World of Electronic Packaging and System Integration ed B Michel and R Aschenbrenner (Dresden: ddp Goldenbogen) pp 42-7
36. Welch W, Chae J and Najafi K 2005 Transfer of metal MEMS packages using a wafer-level solder transfer technique IEEE Trans. Adv. Packag. 28 643-9
37. Nasiri S S and Flannery A F Jr 2005 Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom International Patent W0 2006/101769
38. Tilmans H A C, Van de Peer M D J and Beyne E 2000 The indent reflow sealing (IRS) technique-a method for the fabrication of sealed cavities for MEMS devices J. Microelectromech. Syst. 9 206-17
39. Weiss D, Teomim D, Badihi A and Zilber G 2001 An integrated cavity wafer level chip size package for MEMS Proc. SPIE 4557 183-91
40. Bustgens B, Bacher W, Menz W and Schomburg W K 1994 Micropump manufactured by thermoplastic molding Proc. IEEE MEMS '94 (Oiso, Japan) pp 18-21
41. Schomburg W K, Ahrens R, Bacher W, Goll C, Meizer S and Quinte A 1998 AMANDA-low-cost production of microfluidic devices Sensors Actuators A 70 153-8
42. Sawa K and Esashi M 2001 Micromolding of disposable polymer parts for medical diagnostics Tech. Dig. of the 18th Sensor Symp. (Kawasaki, Japan) pp 229-32
43. Jornod A and Rudorf F 1989 High-precision capacitive absolute pressure sensor Sensors Actuators 17 415-21
44. Esashi M, Eoh S, Matsuo T and Choi S 1987 The fabrication of integrated mass flow controller Dig. of Tech. Papers, Transducers '87 (Tokyo, Japan) pp 830-3
45. Guckel H and Burns D W 1984 Planer processed polysilicon sealed cavities for pressure transducer arrays IEDM '84 Tech. Dig. (San Francisco, CA, USA) pp 223-5
46. Sugiyama S, Shimaoka K and Tabata O 1991 Surface micromachined micro-diaphragm pressure sensors Dig. of Tech. Papers, Transducers '91 (San Francisco, CA, USA) pp 188-91
47. Lin L, McNair K M, Howe R T and Pisano A P 1993 Vacuum-encapsulated lateral microresonators Tech. Dig. Transducers '93 (Yokohama, Japan) pp 270-3
48. Liu C and Tai Y-C 1998 Sealing of micromachined cavities using chemical vapor deposition methods: characterization and optimization J. Microelectromech. Syst. 8 135-45
49. Jones D G, Azevedo R G, Chan M W, Pisano A P and Wijesundara M B 2007 Low temperature ion beam sputter deposition of amorphous silicon carbide for wafer-level vacuum sealing Tech. Dig. MEMS 2007 (Kobe, Japan) pp 275-8
50. Witvrouw A et al 2005 Processing of MEMS gyroscope on top of CMOS ICs ISSCC 2005 pp 88-9
51. Lebouitz K S, Howe R T and Pisano A 1995 Permeable polysilicon etch-access windows for microshell fabrication Dig. of Tech. Papers, Transducers '95 (Stockholm, Sweden) pp 224-7
52. He R and Kim C J 2007 On-wafer monolithic encapsulation by surface micromachining with porous polysilicon shell J. Microelectromech. Syst. 16 462-72
53. Monajemi P, Joseph P J, Kohl P A and Ayazi F 2006 Wafer-level MEMS packaging via thermally released metal-organic membranes J. Micromech. Microeng. 16 742-50
54. Stark B H and Najafi K 2006 A mold and transfer technique for lead-free fluxless soldering and application to MEMS packaging J. Microelectromech. Syst. 15 849-57
55. Guckel H, Burns D W, Busta H H and Detry J F 1985 Laser-recrystalized piezoresistive micro-diaphragm sensor Dig. of Tech. Papers, Transducers '85 (Philadelphia, PA, USA) pp 182-5
56. Shoji S, Nisase T, Esashi M and Matsuo T 1987 Fabrication of an implantable capacitive type pressure sensor Dig. of Tech. Papers, Transducers '87 (Tokyo, Japan) pp 305-8
57. Esashi M, Sugiyama S, Ikeda K, Wang Y and Miyashita H 1998 Vacuum-sealed silicon micromachined pressure sensors Proc. IEEE 86 1627-39
58. Ura N, Nakaichi K, Minami K and Esashi M 1992 Vacuum packaging by anodic bonding The 11th Sensor Symp. Late News (Tokyo, Japan) p 63 (in Japanese)
59. Henmi H, Shoji S, Shoji Y, Yoshimi K and Esashi M 1994 Vacuum packaging for microsensors by glass-silicon anodic bonding Sensors Actuators A 43 243-8
60. Miyashita H and Esashi M 2000 Wide dynamic range silicon diaphragm vacuum sensor by electrostatic servo system J. Vac. Sci. Technol. B 18 2692-7
61. Miyashita H and Kitamura Y 2005 Micromachined capacitive diaphragm Gauge Anelva Technical Report vol 11 pp 37-41 (in Japanese)
62. Fukatsu K, Murakoshi T and Esashi M 1999 Electrostatically levitated micro motor for inertia measurement system Tech. Dig. of Transducers '99 (Sendai, Japan) pp 1558-61
63. Sparks D, Smith R, Schneider R S, Cripe J, Massoud-Ansari S, Chimbayo A and Najafi N 2003 A variable temperature, resonant density sensor made using an improved chip-level vacuum package Sensors Actuators A 107 119-24
64. Moraja M, Amiotti M and Kullberg R 2003 New getter configuration at wafer level for assuring long term stability of MEMS Proc. SPIE 4980 260-7
65. Minami K, Moriuchi T and Esashi M 1995 Cavity pressure control for critical dumping of packaged micro mechanical devices Dig. of Tech. Papers, Transducers '95 (Stockholm, Sweden) pp 240-3
66. Mitchell J, Lahiji G R and Najafi K 2006 Long-term reliability, burn-in and analysis of outgassing in Au-Si Eutectic wafer-level vacuum packages Solid-State Sensors, Actuator and Microsystems Workshop (Hilton Head, SC) pp 376-9
67. Li X, Abe T and Esashi M 2004 An integrated encapsulating technology with high-density plated-through-holes in Pyrex glass ICEE 2004/APCOT MNT 2004 (Sapporo) pp 634-7
68. Parridge A, Lutz M, Kim B, Hopcroft M, Candler R N, Kenny T W, Petersen K and Esashi M 2005 MEMS resonators: getting the packaging right The 9th SEMI Microsystem/MEMS Seminar (Makuhari, Japan) pp 55-8
69. Candler R N, Hopcroft M A, Kim B, Park W-T, Melamud R, Agarwal M, Yama G, Parridge A, Lutz M and Kenny T W 2006 Long-term and accelerated life testing of a novel single-wafer vacuum encapsulation for MEMS resonators J. Microelectromech. Syst. 15 1446-56
70. Ikeda K, Kuwayama H, Kobayashi T, Watanabe T, Nishikawa T and Yoshida T 1988 Silicon pressure sensor with resonant strain gages built into diaphragm Tech. Dig. of the 7th Sensor Symp. (Tokyo, Japan) pp 55-8
71. Esashi M, Ura N and Matsumoto Y 1992 Anodic bonding for integrated capacitive sensors Proc. Micro Electro Mechanical Systems '92 (Travemunde, Germany) pp 43-8
72. Ziaie B, Von Arx J A, Dokmeci R and Najafi K 1996 A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and actuators J. Microelectromech. Syst. 5 166-79
73. Corman T, Enoksson P and Stemme G 1998 Low-pressure-encapsulated resonant structures with integrated electrodes for electrostatic excitation and capacitive detection Sensors Actuators A 66 160-6
74. Anthony T R 1981 Forming electrical interconnection through semiconductor wafers J. Appl. Phys. 52 5340-9
75. Abe T, Li X and Esashi M 2003 Endpoint detectable plating through femtosecond laser drilled glass wafers for electrical interconnections Sensors Actuators A 108 234-8
76. Matsumoto Y 2006 Glass wafers with conductive via-holes for MEMS applications The 10th SEMI Microsystem/MEMS Seminar (Makuhari, Japan) pp 25-8
77. Shoji S and Esashi M 1990 Photoetching and electrochemical discharge drilling of Pyrex glass Tech. Dig. of the 9th Sensor Symp. (Tokyo, Japan) pp 27-30
78. Li X, Abe T, Liu Y and Esashi M 2002 Fabrication of high-density electrical feed-throughs by deep-reactive-ion etching of Pyrex glass J. Microelectromech. Syst. 11 625-9
79. Muller E et al 2005 Development and processing of an anodic bondable LTCC tape Ceramic Interconnect and Ceramic Microsystem Tech. Conf. (Dresden, Germany)
80. Mori M, Kobayashi Y and Kidani N 2007 Low CTE LTCC SEMICON Japan STS Seminar Microsystem/MEMS Session (Makuhari, Japan) pp 15-9
81. Choe S-H, Tanaka S and Esashi M 2007 A matched expansion MEMS probe card with low CTE LTCC substrate IEEE Int. Test Conf. 2007 (Santa Clara, CA, USA) paper 20.2
82. Yun C H, Martin J R, Chen T and Davis D 2007 MEMS wafer-level packaging with conductive vias and wafer bonding Dig. of Tech. Papers, Transducers '07 (Lion, France) pp 2091-4
83. Lin C-W, Yang H-A, Wang W C and Fang W 2007 Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnection J. Micromech. Microeng. 17 1200-5
84. Maeda R, Murakoshi Y, Shimizu T, Li Y and Takizawa H 2001 Si based print circuit board fabricated by Si deep etching and metal powder injection molding Proc. SPIE 4235 209-16
85. Sumikawa M and Esashi M 2005 Electrical interconnection through a Si wafer for high speed 19th Convention on Electronic Packaging (Chiba, Japan) pp 117-8 (in Japanese)
86. Chang C, Abe T and Esashi M 2004 Trench filling characteristics of low stress TEOS/ozone oxide deposited by PECVD and SACVD Microsyst. Technol. 10 97-102
87. Uchiyama H 2005 What quality improvement can SD achieve for MEMS devices The 9th SEMI Microsystem/MEMS Seminar (Makuhari, Japan) pp 83-6 (in Japanese)
88. Izawa Y, Tsurumi Y, Tanaka S, Kikuchi H, Sueda K, Nakata Y, Esashi M, Miyanaga N and Fujita M 2007 Debris-free laser-assisted low-stress dicing for multi-layered MEMS Proc. 24th Sensor Symp. (Tokyo, Japan) pp 19-23
89. Esashi M, Komatsu H, Matsuo T, Takahashi M, Takishima T, Imabayashi K and Ozawa H 1982 Fabrication of catheter-tip and sidewall miniature pressure sensors IEEE Trans. Electron Dev. ED-29 57-63