Fabrication, characterization, and analysis of a DRIE CMOS-MEMS gyroscope

IEEE Sensors Journal

Volumn 3, Issue 5, 2003, Pages 622-631

  Xie, Huikai ^a   Fedder, Gary K ^b  

^a University of Florida   (United States)

^b CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

CMOS microelectromechanical systems (MEMS); Deep reactive ion etched (DRIE); Electrical isolation; Gyroscope; Integrated gyroscope; Single crystal silicon

Indexed keywords

ATMOSPHERIC PRESSURE; DRY ETCHING; GYROSCOPES; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; NATURAL FREQUENCIES; OPTIMIZATION; PRINTED CIRCUIT BOARDS; SENSITIVITY ANALYSIS; SILICON; SINGLE CRYSTALS; STIFFNESS; THIN FILM DEVICES; TOPOLOGY;

CMOS-MICROELECTROMECHANICAL SYSTEMS (MEMS); DEEP REACTIVE-ION ETCHED (DRIE); ELECTRICAL ISOLATION; INTEGRATED GYROSCOPE; SINGLE-CRYSTAL SILICON;

CMOS INTEGRATED CIRCUITS;

EID: 3042699997     PISSN: 1530437X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSEN.2003.817901     Document Type: Article

References (24)

1. H. Xie and G. K. Fedder, "A CMOS-MEMS lateral-axis gyroscope," in Proc. 14th IEEE Int. Conf. Microelectromechanical Systems, Interlaken, Switzerland, Jan. 21-25, 2001, pp. 162-165.
2. H. Luo, X. Zhu, H. Lakdawala, L. R. Carley, and G. K. Fedder, "A copper CMOS- MEMS z-axis gyroscope," in Proc. 15th IEEE Int. Conf. Microelectromechanical Systems, Las Vegas, NV, Jan. 21-25, 2001, pp. 631-634.
3. H. Xie, L. Erdmann, X. Zhu, K. J. Gabriel, and G. K. Fedder, "Post-CMOS processing for high-aspect-ratio integrated silicon microstructures," IEEE/ASME J. Microelectromech. Syst., vol. 11, pp. 93-101, Feb. 2002.
4. G. K. Fedder, S. Santhanam, M. L. Reed, S. C. Eagle, D. F. Guillou, M. S.-C. Lu, and L. R. Carley, "Laminated high-aspect-ratio microstructures in a conventional CMOS process," Sens. Actuators A, vol. A57, pp. 103-110, 1996.
5. B. Boxenhorn, "Planar Inertial Sensor," U.S. patent no 4 598 585.
6. P. Greiff, B. Boxenhorn, T. King, and L. Niles, "Silicon monolithic micromechanical gyroscope," in Transducers, San Francisco, CA, June 24-27, 1991, pp. 966-968.
7. J. Bernstein, S. Cho, A. T. King, A. Kourepenis, P. Maciel, and M. Weinberg, "A micromachined comb-drive tuning fork rate gyroscope," in Proc. IEEE Microelectromechanical Systems, Fort Lauderdale, FL, Feb. 7-10, 1993, pp. 143-148.
8. M. W. Putty and K. Najafi, "A micromachined vibrating ring gyroscope," in Tech. Dig. Solid-State Sens. Actuator Workshop, Hilton Head Island, SC, June 13-16, 1994, pp. 213-220.
9. W. A. Clark, R. T. Howe, and R. Horowitz, "Surface micromachined z-axis vibratory rate gyroscope," in Proc. Tech. Dig. Solid-State Sens. Actuator Workshop, Hilton Head Island, SC, June 3-6, 1996, pp. 283-287.
10. T. Juneau, A. P. Pisano, and J. H. Smith, "Dual axis operation of a micromachined rate gyroscope," in Tranducers, Chicago, IL, June 16-19, 1997, pp. 883-886.
11. J. A. Geen, S. J. Sherman, J. F. Chang, and S. R. Lewis, "Single-chip surface-micromachining integrated gyroscope with 50 deg/hour root Allan variance," in Dig. IEEE Int. Solid-State Circuits Conf., San Francisco, CA, Feb. 3-7, 2002, pp. 426-427.
12. T. K. Tang et al., "A packaged silicon MEMS vibratory gyroscope for microspacecraft," in Proc. 10th IEEE Int. Conf. Microelectromechanical Systems, Nagoya, Japan, Jan. 26-30, 1997, pp. 500-505.
13. Y. Mochida, M. Tamura, and K. Ohwada, "A micromachined vibrating rate gyroscope with independent beams for the drive and detection modes," in Proc. 12th IEEE Int. Conf. Microelectromechanical Systems, Orlando, FL, Jan. 17-21, 1999, pp. 618-623.
14. M. Lutz, W. Golderer, J. Gerstenmeier, J. Marek, B. Maihofer, S. Mahler, H. Munzel, and U. Bischof, "Aprecision yaw rate sensor in silicon micromachining," in Transducers, Chicago, IL, June 16-19, 1997, pp. 847-850.
15. W. Geiger, B. Folkmer, U. Sobe, H. Sandmaier, and W. Lang, "New designs of micromachined vibrating rate gyroscopes with decoupled oscillation modes," Sens. Actuators A, vol. 66, pp. 118-124, 1998.
16. K. Y. Park, H. S. Jeong, S. An, S. H. Shin, and C. W. Lee, "Lateral gyroscope suspended by two gimbals through high aspect ratio ICP etching," in Transducers, Sendai, Japan, June 7-10, 1999, pp. 972-975.
17. S. Adams, J. Groves, K. Shaw, T. Davis, D. Cardarelli, R. Carroll, J. Walsh, and M. Fontanella, "A single-crystal silicon gyroscope with decoupled drive and sense," in Proc. SPIE, vol. 3876, 1999, pp. 74-83.
18. T. J. Brosnihan, J. M. Bustillo, A. P. Pisano, and R. T. Howe, "Embedded interconnect and electrical isolation for high-aspect-ratio, SOI inertial instruments," in Transducers, Chicago, IL, June 16-19, 1997, pp. 637-640.
19. MEMCAD User's Manual. Cary, NC: Coventor, http://www.coventor.com.
20. W. Hemmert, M. S. Mermelstein, and D. M. Freeman, "Nanometer resolution of 3-D motions using video interference microscopy," in 12th IEEE Int. Conf. Microelectromechanical Systems, Orlando, FL, Jan. 17-21,1999, pp. 302-308.
21. H. Xie, G. K. Fedder, Z. Pan, and W. Frey, "Phase and vibration analysis for a CMOS-MEMS gyroscope," Int. J. Nonlinear Sci. Numer. Simulations, vol. 3, pp. 319-324, 2002.
22. H. Luo, G. Zhang, L. R. Carley, and G. K. Fedder, "A post-CMOS micromachined lateral accelerometer," J. Microelectromech. Syst., vol. 11, pp. 188-195, 2002.
23. C. Acar and A. Shkel, "A design approach for robustness improvement of rate gyroscopes," in Proc. Int. Conf. Modeling and Simulation of Microsystems, Hilton Head Island, SC, Mar. 19-21, 2001, pp. 80-83.
24. V. A. Apostolyukl, V. J. Logeeswaran, and F. E. H. Tay, "Efficient design of micromechanical gyroscopes," J. Micromech. Microeng., vol. 12, pp. 948-954, 2002.