Novel wafer-level CSP for stacked MEMS / IC dies with hermetic sealing

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 811-816

  Sugizaki, Yoshiaki ^a   Nakao, Mitsuhiro ^a   Higuchi, Kazuhito ^a   Miyagi, Takeshi ^a   Obata, Susumu ^a   Inoue, Michinobu ^a   Endo, Mitsuyoshi ^a   Shimooka, Yoshiaki ^a   Kojima, Akihiro ^a   Mori, Ikuo ^a   Shibata, Hideki ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; COMPUTER NETWORKS; COST EFFECTIVENESS; ELECTROMECHANICAL DEVICES; ENGINEERING GEOLOGY; MEMS; MICROELECTROMECHANICAL DEVICES; WAFER BONDING; WIRE;

ELECTRONIC COMPONENTS; HERMETIC SEALING; WAFER LEVELS;

COMPUTER OPERATING PROCEDURES;

EID: 51349128787     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550068     Document Type: Conference Paper

References (5)

1. Ikehashi, T. et al, "An RF MEMS Variable Capacitor with Intelligent Bipolar Actuation," Proc The International Solid-State Circuits Conference, San Francisco, CA, Feb. 2008, pp. 582-583.
2. Yamazaki, H. et al., "An intelligent bipolar actuation method with high stiction immunity for RF MEMS capacitive switches and variable capacitors," Sensors and Actuators A: Physical, Vol. 139, Issues 1-2, pp. 233-236, Sept. 12, 2007.
3. Hou, Michelle M, "The SUPERCSP Package Solution: A Wafer Level Package," Advances in Electronic Packaging 1999 (Proc of the Pacific RIM/ASME International Intersociety Electronics & Photonic Packaging Conference; InterPACK'99), Vol.2, pp. 1099-1102.
4. st Electronic Component & Technology Conference, Florida, FL, May. 2001, pp. 35-39.
5. th International Symposium on Microelectronics, San Diego, CA, Oct. 2006, pp. 1035-1042.