MEMS for wireless communications: 'From RF-MEMS components to RF-MEMS-SiP'

Journal of Micromechanics and Microengineering

Volumn 13, Issue 4, 2003, Pages

  Tilmans, Harrie A C ^a   De Raedt, Walter ^a   Beyne, Eric ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC SURFACE WAVE FILTERS; ELECTRIC INDUCTORS; MICROMACHINING; MILLIMETER WAVE DEVICES; RESONATORS; TRANSCEIVERS; VARACTORS; WIRELESS TELECOMMUNICATION SYSTEMS;

RADIOFREQUENCY (RF) DEVICES;

MICROELECTROMECHANICAL DEVICES;

EID: 0038374162     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/13/4/323     Document Type: Conference Paper

References (143)

1. Collander P 1999 Packaging technologies cellular phones Adv. Microelectron. 26 13-6
2. Mannion P 1999 Cellular/PCS systems take the globe by storm Electron. Des. September 63-8
3. Pulsford N 2002 Passive integration technology: targeting small accurate RF parts November RF Des. 40-8
4. Burghartz J N 2001 Status and trends of silicon RF technology Microelectron. Reliab. 41 13-9
5. Nguyen N M and Meyer R G 1990 Si IC-compatible inductors and LC passive filters IEEE J. Solid-State Circuits 25 1028-31
6. Burghartz J N, Soyuer M and Jenkins K A 1996 Microwave inductors and capacitors in standard interconnect silicon technology IEEE Trans. Microw. Theory Tech. 44 100-3
7. Burghartz J N, Soyuer M and Jenkins K A 1996 Integrated RF and microwave components in BiCMOS technology IEEE Trans. Electron Devices 43 1559-70
8. Burghartz J N, Edelstein D C, Jenkins K A and Kwark Y H 1997 Spiral inductors and transmission lines in silicon technology using copper-damascene interconnects and low-loss substrates IEEE Trans. Microw. Theory Tech. 45 1961-8
9. Ashby K B, Koullias I A, Finley W C, Bastek J J and Moinian S 1996 High Q inductors for wireless applications in a complementary silicon bipolar process IEEE J. Solid-State Circuits 31 4-9
10. Park M, Kim C-H, Park M-Y, Kim S-D, Youn Y-S and Yu H K 1999 Frequency-dependent series resistance of monolithic spiral inductors IEEE Microwave Quid. Wave Lett. 9 514-6
11. Kamogawa K, Nishikawa K, Tokumitsu T and Tanaka M 1999 A novel high-Q inductor based on Si 3D MMIC technology and its application 1999 IEEE MTT-S Conf. (Anaheim, CA) pp 489-92
12. Rogers J W M, Levenets V, Pawlowicz C A, Tarr N G, Smy T J and Plett C 2001 Post-processed Cu inductors with application to a completely integrated 2-GHz VCO IEEE Trans. Electron Devices 48 1284-7
13. Carchon G, De Raedt W and Beyne E 2002 High-Q RF inductors on low resistivity silicon through wafer post-processing Proc. MAPS 2002 (Denver, CO, USA) pp 604-9
14. van de Walle G 1998 Integration of passive components: an introduction Philips J. Res. 51 353-61
15. Tummala R R, White G E, Sundaram V and Bhattacharyam S 2000 SoP: the microelectronics for the 21st century with integral passive integration Adv. Microelectron. 27 13-9
16. Gray P. R. and Meyer R. G. 1995 Future directions in silicon ICs for RF personal communications 1995 IEEE Custom Integrated Circuits Conf. (Santa Clara, CA) pp 83-90
17. Nguyen C T-C 2001 Transceiver front-end architectures using vibrating micromechanical signal processors Dig. of papers Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (12-14 Sept. 2001) pp 23-32
18. Brooks R, Guilford M and Hendricks D 2001 0201 component assembly: a tough test On Board Technology pp 50-3
19. Brown W D 1999 Introduction and overview of microelectronic packaging Adv. Electronic Pack. with Emphasis on Multichip Modules ed W D Brown (New York: IEEE)
20. Carchon G, Nauwelaers B, Pieters P, Vaesen K, De Raedt W and Beyne E 2001 Multi-layer thin-film MCM-D for the integration of high performance wireless front-end systems Microw. J. 44 96-110
21. Morrison D 2000 Low-temperature cofired ceramics fuel growth of high-frequency designs Electron. Des. April 95-102
22. Scrantom C Q and Lawson J C 1999 LTCC technology: where we are and where we're going to IEEE MTT-S Int. Topical Symp. for Wireless Appl. (Feb. 1999) pp 193-200
23. Maluf N 2000 An Introduction to Microelectromechanical Systems Engineering (Boston: Artech House Publishers)
24. Madou M 1997 Fundamentals of Microfabrication (New York: CRC Press)
25. De Los Santos H 1999 Introduction to Microelectromechanical (MEM) Microwave Systems (Boston, MA: Artech House Publishers)
26. Larson L E, Hackett R H and Lohr R F 1991 Microactuators for GaAs-based microwave integrated circuits Transducers'91 (San Francisco, CA, June 1991) pp 743-6
27. Buck D C 1994 Non-contact two position microelectronic cantilever switch US Patent 5,367,136
28. Nguyen C T-C and Howe R T 1993 CMOS micromechanical resonator oscillator IEDM 1993 pp 199-202
29. Ruby R C and Merchant P P 1996 Tunable thin film acoustic resonators and method for making the same US Patent 5,587,620
30. Goldsmith C, Lin T H, Powers B, Wu W-R and Norvell B 1995 Micromechanical membrane switches for microwave applications IEEE MTT-S Digest pp 91-4
31. Yao J J and Frank-Chang M 1995 A surface micromachined miniature switch for telecommunications applications with signal frequencies from dc up to 4 GHz Transducers'95 (Stockholm, Sweden) pp 384-7
32. Field L A and Ruby R C 1995 Thermally actuated micromachined microwave switch US Patent 5,467,067
33. Nguyen C T-C, Katehi L P B and Rebeiz G M 1998 Micromachined devices for wireless communications Proc. IEEE 86 1756-68
34. Yao J J 2000 Topical review: RF MEMS from a device perspective J. Micromech. Microeng. 10 R9-R38
35. Richards R J and De Los Santos H J 2001 MEMS for RF/microwave wireless applications: the next wave Microwave J. 44 20-41
36. De Los Santos H J and Richards R J 2001 MEMS for RF/microwave wireless applications: the next wave. Part II Microwave J. 44 142-52
37. Rebeiz G M and Muldavin J B 2001 RF MEMS switches and switch circuits IEEE Microw. Mag. 2 59-71
38. Rebeiz G M, Tan G-L and Hayden J S 2002 RF MEMS phase shifters: design and applications IEEE Microwave Mag. 3 72-81
39. Tilmans H A C 2002 MEMS components for wireless communications EUROSENSORS XVI (Prague. Czech Republic 15-18 Sept. 2002) pp 1-34 (on CD-ROM only)
40. Sun Y, van Zeijl H, Tauritz J L and Baets R G F 1996 Suspended membrane inductors and capacitors for application in silicon MMIC's IEEE 1996 Microwave and Millimeter-Wave Monolithic Circuits Symp. pp 99-102
41. Chang J Y-C, Abidi A A and Gaitan M 1993 Large suspended inductors on silicon and their use in a 2-micron CMOS RF amplifier IEEE Electron Devices Lett. 14 246-8
42. Tilmans H A C, Baert K, Verbist A and Puers R 1996 CMOS foundry-based micromachining J. Micromech. Microeng. 6 122-7
43. Park J Y and Allen M G 1999 Packaging-compatible high Q microinductors and microfilters for wireless applications IEEE Trans. Adv. Packag. 22 207-13
44. Park J Y and Allen M G 1999 High Q spiral-type microinductors on silicon substrates IEEE Trans. Magn. 35 3544-6
45. Yoon J-B, Han C-H, Yoon E and Kim C-K 1999 High-performance three-dimensional on-chip inductors fabricated by novel micromachining technology for RF MMIC 1999 IEEE MTT-S (Anaheim, USA) pp 1523-6
46. Jiang H, Wang Y, Yeh J-L A and Tien N C 2000 Fabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating IEEE MTT-S (Boston, MA, USA, 11-16 June 2000) pp 279-82
47. Dahlmann G W, Yeatman E M, Young P, Robertson I D and Lucyszyn S 2001 High Q achieved in microwave inductors fabricated by parallel self-assembly Proc. Transducers '01 (Munich, Germany 10-14 June 2001) 1098-1101
48. Pieters P, Vaesen K, Carchon G, Brebels S, De Raedt W, Beyne E and Mertens R P 2000 High-Q spiral inductors for high performance integrated RF front-end sub-systems IMAPS 2000 (Boston, MA, USA, 20-22 Sept. 2000) pp 500-5
49. Rijks Th G S M, van Beek J T M, Jansman A B M, Kammerer M K and van Esch H A 2001 RF integrated passives in three dimensions IMAPS 2001 (Baltimore, USA, 9-11 Oct.) pp 471-6
50. de Graauw A, Copetti C and Weekamp W 2000 A new thin film passive integration technology for miniaturisation of mobile phone front end modules 2000 IEEE MTT-S (Boston, MA, USA, 11-16 June 2000) pp 1925-8
51. Davis P, Smith P, Campbell E, Lin J, Gross K, Bath G, Low Y, Lau M, Degani Y, Gregus J, Frye R and Tai K 1998 Silicon-on-silicon integration of a GSM transceiver with VCO resonator Int. Solid-State Circuits Conf. 1998 pp 248-9
52. Van Beek J, van Delden M, Jansman A, Boogaard A and Kemmeren A 2001 The integration of RF passives using thin-film technology on high-ohmic Si in combination with thick-film interconnect IMAPS 2001 (Baltimore, USA, 9-11 Oct. 2001) pp 467-70
53. Arnold R G, Faulkner C C and Pedder D J 1997 Silicon MCM-D technology for RF integration 1997 Int. Conf. on MultiChip Modules (2-4 April) pp 340-4
54. Goldsmith C, Randall J, Eshelman S, Lin T H, Denniston D, Chen S and Norvell B 1996 Characteristics of micromachined switches at microwave frequencies 1996 IEEE MTT-S Digest pp 1141-44
55. Mihailovich R E, Kim M, Hacker J B, Sovero E A, Studer J, Higgins J A and DeNatale J F 2001 MEMS relay for reconfigurable RF circuits IEEE Microw. Wirel. Compon. Lett. 11 53-5
56. Goldsmith C L, Yao Z, Eshelman S and Denniston D 1998 Performance of low-loss RF MEMS capacitive switches IEEE Microw. Guid. Wave Lett. 8 269-71
57. Yao Z J, Chen S, Eshelman S, Denniston D and Goldsmith C 1999 Micromachined low-loss microwave switches IEEE J. Microelectromech. Syst. 8 129-34
58. Muldavin J B and Rebeiz G M 2000 High isolation CPW MEMS shunt switches: Part 1. Modeling IEEE Trans. Microw. Theory Tech. 48 1045-52
59. Muldavin J B and Rebeiz G M 2000 High isolation CPW MEMS shunt switches: Part 2. Design IEEE Trans. Microw. Theory Tech. 48 1053-6
60. Peroulis D, Pacheco S, Sarabandi K and Katehi L P B 2000 MEMS devices for high isolation switching and tunable filtering 2000 IEEE MTT-S Conf. (Boston, MA) pp 1217-20
61. Park J Y, Kim G H, Chung K W and Bu J U 2000 Electroplated RF MEMS capacitive switches MEMS'2000 (Miyazaki, Japan, 23-27 Jan. 2000) pp 639-44
62. Ulm M, Reimann M, Walter T, Müller-Fiedler R and Kasper E 2001 Capacitive RF MEMS switches for the W-band 31st European Microwave Conf. (London, UK, 25-27 Sept. 2001) pp 287-90
63. Jansen H, Pamidighantam S, De Raedt W, Beccarini G, Dimonaco O, Baert K and Tilmans H A C 2000 Micromachined devices for space telecom applications Proc. 3rd Round Table on Micro/Nano-Technologies for Space ESTEC (Noordwijk, The Netherlands, 15-17 May 2000) pp 135-40
64. Tilmans H A C, Ziad H, Jansen H, Di Monaco O, Jourdain A, De Raedt W, Rottenberg X, De Backer E, De Caussemaeker A and Baert K 2001 Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab IEDM 2001 (Washington, DC, 3-5 Dec. 2001) pp 921-4
65. Rottenberg X, Jansen H, Fiorini P, De Raedt W and Tilmans H A C 2002 Novel RF-MEMS capacitive switching structures Proc. 32nd European Microwave Conf. (Milan, 23-27 Sept. 2002) pp 809-12
66. Sovero E A, Mihailovich R, Deakin D S, Higgins J A, Yao J J, DeNatale J F and Hong J H 1999 Monolithic GaAs PHEMT MMICs integrated with high performance MEMS microrelays SBMO/IEEE MTT-S IMOC'99 (Rio de Janeiro, Brazil, 1999) pp 257-60
67. Hyman D, Lam J, Warneke B, Schmitz A, Hsu T Y, Brown J, Schaffner J, Walston A, Loo R Y, Mehregany M and Lee J 1999 Surface-micromachined RF MEMS switches on GaAs Int. J. RF Microw. Comput. Aided Eng. 9 348-61
68. Suzuki K, Chen S, Marumoto T, Ara Y and Iwata R 1999 A micromachined RF microswitch applicable to phased-array antennas 1999 IEEE MTT-S Conf. (Anaheim, CA) pp 1923-6
69. Zavracky P M, McGruer N E, Morrison R H and Potter D 1999 Microswitches and microrelays with a view toward microwave applications Int. J. RF Microw. Comput. Aided Eng. 9 338-47
70. Fujii M, Sato S, Hosoya K. and Imanaka K 2001 Micro machined relay with vertical feed through and wirebond-less package 51st Relay (NARM) Conf. pp 16.1-16.4
71. Vaughan C 2001 RF MEMS components for radio architecture Spring 2001 Sensors Expo (Chicago, 11, USA, 5-7 June 2001) 6 p
72. Hah D, Yoon E and Hong S 2000 A low voltage actuated micromachined microwave switch using torsion springs and leverage IEEE MTT-S Int. Microwave Symp. (Boston, MA, USA, 11-16 June 2000) pp 157-60
73. Milanovic V, Maharbiz M, Singh A, Warneke B, Zhou N, Chan H K and Pister K S J 2000 Microrelays for batch transfer integration in RF systems Proc. MEMS'2000 (Miyazaki, Japan, 23-27 Jan. 2000) pp 787-92
74. Park J-H, Kang K, Kang N, Kim C, Song C, Cheon C-Y, Kwon Y and Kim Y-K 2001 A 3-voltage actuated micromachined RF switch for telecommunications applications Transducers'01 (Munich, Germany, 10-14 June 2001) pp 1540-3
75. Jourdain A, Brebels S, De Raedt W and Tilmans H A C 2001 The influence of 0-level packaging on the performance of RF-MEMS devices 31st European Microwave Conf. (London, UK, 24-28 Sept. 2001) pp 403-6, 419
76. Maragomenos A, Peroulis D, Herrick K J and Katehi L P B 2001 Silicon micromachined packages for RF MEMS switches 31st European Microwave Conf. (London, UK, 25-27 Sept. 2001) vol 1 pp 271-74
77. Park Y-K, Park H-W, Lee D-J, Park J-H, Song I-S, Kim S-W, Song C-M, Lee Y-H, Kim C-J and Ju B-K 2002 A novel low-loss wafer-level RF-MEMS packaging of the RF-MEMS devices MEMS 2002 (Las Vegas, NV, USA, 20-24 Jan. 2002) pp 681-4
78. Goldsmith C, Ehmke J, Malczewski A, Pillans B, Eshelman S, Yao Z, Brank J and Eberly M 2001 Lifetime characterization of capacitive RF MEMS switches 2001 IEEE MTT-S (Phoenix, AZ, USA, 20-25 May 2001) pp 227-30
79. DeNatale J, Mihailovich R and Waldrop J 2002 Techniques for reliability analysis of MEMS RF switch 2002 IEEE Int. Reliability Physics Symp. (Dallas, TX, USA, 7-11 April 2002) pp 116-7
80. Walraven J A, Cole E I Jr. Sloan L R, Hietala S, Tigges C P and Dyck C W 2001 Failure analysis of radio frequency (RF) microelectromechanical systems (MEMS) SPIE vol 4558 pp 254-9
81. De Wolf I and van Spengen W M 2002 Techniques to study the reliability of metal RF MEMS capacitive switches Microelectron. Reliab. 42 1789-94
82. Lafontan X, Le Touze C, Wenk B, Kolesnik I, Pressecq F, Perez G, Nicot J-M, Dardalhon M and Rigo S 2002 Environmental test bench for reliability studies: influence of the temperature on RF switches with metallic membranes Proc. Design, Test, Integration and Packaging of MEMS/MOEMS 2002 (DTIP 2002) Proc. SPIE 4755 624-33
83. Soyuer M, Jenkins K A, Burghartz J N and Hulvey M D 1996 A 3-V 4-GHz nMOS voltage-controlled-oscillator with integrated resonator IEEE J. Solid-State Circuits 31 2042-5
84. Vaesen K, Donnay S, Pieters P, Carchon G, Diels W, Wambacq P, De Raedt W, Beyne E and Engels M 2000 Chip-package co-design of a 4.7 GHz VCO Int. J. Microcircuits Electron. Packag. 23 272-9
85. Young D J and Boser B E 1996 A micromachined variable capacitor for monolithic low-noise VCOs Solid-State Sensor and Actuator Workshop (Hilton Head, SC, USA, 2-6 June 1996) pp 86-9
86. Young D J, Boser B E, Malba V and Bernhardt A F 2001 A micromachined RF low phase noise voltage-controlled oscillator for wireless communications Int. J. RF Microwave CAE 11 285-300
87. Dec A and Suyama K 1998 Micromachined electro-mechanically tunable capacitors and their applications to RF IC's IEEE Trans. Microw. Theory Tech. 46 2587-96
88. Yao J J, Park S T and DeNatale J 1998 High tuning-ratio MEMS-based tunable capacitors for RF communications applications Solid-State Sensor and Actuator Workshop (Hilton Head, SC, USA, 8-11 June 1998) pp 124-7
89. Pozar D M 1998 Microwave Engineering 2nd edn (New York: Wiley)
90. Rebeiz G M, Katehi L P B, Weller T M, Chi C-Y and Robertson S V 1997 Micromachined membrane filters for microwave and millimeter-wave applications Int. J. Microw. Millimeter-Wave CAE 7 149-66
91. Blondy P, Brown A R, Cros D and Rebeiz G M 1998 Low-loss micromachined filters for millimeter-wave communication systems IEEE Trans. Microw. Theory Tech. 46 2283-8
92. Park J-H, Kim H-T, Kwon Y and Kim Y-K 2000 Tunable millimeter-wave filters using a coplanar waveguide and micromachined variable capacitors J. Micromech. Microeng. 11 706-12
93. Muldavin J B and Rebeiz G M 2000 X-band tunable MEMS resonators Topical Meet. Silicon Monolithic Integr. Circuits in rf Syst pp 116-8
94. Papapolymerou J, Cheng J-C, East J and Katehi L P B 1997 A micromachined high-Q X-band resonator IEEE Microw. Guid. Wave Lett. 7168-70
95. Kim C, Song I, Song C, Cheon C, Kwon Y and Lee S 1999 A micromachined cavity resonator for mm-wave oscillator applications Transducers'99 (Sendai, Japan, 7-10 June) pp 1268-71
96. Guillon B, Cros D, Pons P, Grenier K, Parra T, Cazaux J L, Lalaurie J C, Graffeuil J and Plana R 1999 Design and realization of high Q millimeter-wave structures through micromachining techniques 1999 IEEE MTT-S (Anaheim, CA, USA, 13-19 June 1999) pp 1519-22
97. Tilmans H A C and Legtenberg R 1994 Electrostatically driven vacuum encapsulated polysilicon resonators: Part II. Theory and performance Sensors Actuators A 45 67-84
98. Cleland A N and Roukes M L 1996 Fabrication of high frequency nanometer scale mechanical resonators from bulk Si crystals Appl. Phys. Lett. 69 2653-55
99. Hsu W-T, Clark J R and Nguyen C T-C 2001 A sub-micron capacitive gap process for multiple-metal-electrode lateral micromechanical resonators MEMS 2001 (Interlaken, Switzerland, 21-25 January 2001) pp 349-52
100. Majjad H, Coudevylle J-R, Basrour S and de Labachelerie M 2001 Modeling and characterization of Lamé-mode microresonators realized by UV-LIGA Transducers'01 (Munich, Germany, 10-14 June 2001) pp 300-3
101. Clark J R, Bannon F D III, Wong A-C and Nguyen C T-C 1997 Parallel-resonator HF micro-mechanical bandpass filters Transducers'97 (Chicago, IL, USA, 16-19 June) pp 1161-4
102. Bannon F D III, Clark J R and Nguyen C T-C 2000 High-Q HF microelectromechanical filters IEEE J. Solid-State Circuits 35 512-26
103. Ruby R and Merchant P 1994 Micromachined thin film bulk acoustic resonators 1994 IEEE Int. Frequency Control Symp. pp 135-8
104. Lutsky J J, Naik R S, Reif R and Sodini C G 1996 A sealed cavity TFR process for RF bandpass filters IEDM 1996 (San Francisco, CA, USA, 8-11 Dec 1996) pp 95-8
105. Davidson E 2001 SoC or SoP? A balanced approach ECTC2001 (Orlando, Fl, USA, 29 May-1 June 2001) pp 529-34
106. Lim K, Pinel S, Davis M, Sutono A, Lee C-H, Heo D, Obatoynbo A, Laskar J, Tantzeris E M and Tummala R 2002 RF-system-on-package (SOP) for wireless communications IEEE Microw. Mag. 3 88-99
107. Rogers J W M, Macedo J A and Plett C 2002 A completely integrated 1.9-GHz receiver front-end with monolithic image-reject filter and VCO IEEE Trans. Microw. Theory Tech. 50 210-5
108. Rapala-Virtanen T 2002 Status and future of high density interconnect PWBs OnBoard Technology (June 2002) pp 38-41
109. Zhou J, Myers J D and Felten J J 2002 Embedded passives technology for PCBs: materials, design, and process Proc.IMAPS 2002 (Denver, CO, USA) pp 577-82
110. Dalmia S, Hee Lee S, Bhattacharya S, Ayazi F and Swaminathan M 2002 High-Q RF passives on organic substrates using a low-cost low-temperature laminate process Proc. DTIP 2002 SPIE Proc. 4755 660-9
111. Drevon C 2001 RF packaging for space applications: from micropackage to SOP - system on a package Microelectron. Reliab. 41 1649-56
112. Widegren J, Martensson E and Olofsson L-A 2001 High performance Bluetooth™ module using flip-chip and LTCC 38th IMAPS Nordic Conf. (Oslo, 23-26 Sept. 2001) pp 126-7
113. Sutono A, Heo D, Chen Y-J E and Laskar J 2001 High-Q LTCC-based passive library for wireless system-on-package (SOP) module development IEEE Trans. Microw. Theory Tech. 49 1715-24
114. M̈ller J 1996 High-quality RF-inductors in LTCC Proc. ISHM Int. Symp, on Microelectronics (Minneapolis) pp 60-5
115. Pulsford N J, van Seek J T M, van Delden M H W M, Boogaard A and Milsom R F 1999 Passive integration on Si for RF circuits in wireless applications 1999 IEEE MTT-S Conf. (Anaheim, CA) pp 1897-900
116. Webpage http://www.sychip.com/30-rf.html
117. Jeong I-H, Nam C-M, Lee C Y, Moon J H, Lee J-S, Kim D-W and Kwon Y-S 2002 High quality RF passive integration using 35 μm thick oxide manufacturing technology ECTC 2002 (San Diego, USA) pp 1007-11
118. Beyne E, van Hoof R and Aachen A C 1995 The use of BCB and photo-BCB dielectrics in MCM-D for high-speed digital and microwave applications Int. Multichip Modules Conf. (Denver, CO, USA, 19-21 April 1995) pp 513-8
119. de Samber M, van Veen C, van Delden M, Milsom R and Pulsford N 2001 A new wafer level chip size MCM-D technology for cellular applications HDI 2001 (Santa Clara, CA, USA, 18-20 April 2001) pp 345-51
120. Albert P, Costello J and Salomon P 2000 MEMS in CMOS-21st century RF and microwave applications RF DESIGN pp 32-6
121. Carchon G, Brebels S, Vaesen K, De Raedt W and Beyne E 2002 Spiral inductors in multi-layer thin-film MCM-D IMAPS Europe (Cracow, Poland, 16-18 June 2002) pp 255-60
122. Webpage http://www.dow.com (click search and enter BCB)
123. Carchon G, Brebels S, De Raedt W and Nauwelaers B 2000 Accurate measurement and characterization up to 50 GHz of CPW-based integrated passives in microwave MCM-D ECTC 2000 (Las Vegas, NV, USA, 21-24 May 2000) pp 459-64
124. Carchon G, Pieters P, Vaesen K, Brebels S, Schreurs D, Vandenberghe S, De Raedt W, Nauwelaers B and Beyne E 2000 Design-oriented measurement-based scaleable models for multilayer MCM-D integrated passives. Implementation in a design library offering automated layout HDI 2000 (Denver, CO, USA, 26-28 April) pp 196-201
125. Carchon G, De Raedt W and Nauwelaers B 2001 Integration of CPW quadrature couplers in multi-layer thin-film MCM-D IEEE Trans. Microw. Theory Tech. 49 1770-6
126. Pieters P, Brebels S, De Raedt W, Beyne E and Mertens R P 1999 Distributed microwave MCM-D circuits for X- and K-band applications Int. J. Microcircuits Electron. Packag. 22 280-7
127. Carchon G J, Schreurs D M M M-P, De Raedt W, Van Loock P and Nauwelaers B K J C 2001 A direct Ku-band linear subharmonically pumped BPSK and I/Q vector modulator in multilayer thin-film MCM-D IEEE Trans. Microw. Theory Tech. 49 1374-82
128. Brebels S, Soliman E A, Carchon G, Vaesen K, De Raedt W, Beyne E, Vandenbosch G A E and Mertens R P 2002 The antenna: cornerstone for system-on-package integration of future wireless systems Belgian J. Electron. Commun. 1 23-32
129. Stoukatch S, Vaesen K, Hong Meng H and Beyne E 2002 Mixed assembly on PCB of wide variety components (MCM-D SMDs bare dies) using wire bonding and SMT ECTC 2002 (San Diego, CA, USA) pp 1671-4
130. De Raedt W, Brebels S, Monfraix Ph, Carchon G, Jourdain A and Tilmans H A C 2001 0-level packaging techniques for flip-chip mounted MMICs 31st European Microwave Conf. (London, UK, 24-28 Sept. 2001) pp 239-42
131. Tilmans H A C, van de Peer M D J and Beyne E 2000 The indent reflow sealing (IRS) technique - a method for the fabrication of sealed cavities for MEMS devices J. Microelectromech. Syst. 9 206-17
132. Carchon G, Di Monaco O, Vaesen K, Brebels S, De Raedt W and Nauwelaers B 2000 Design and characterization of CPW feedthroughs in multi-layer thin-film MCM-D RAWCON (Denver, CO, 10-13 Sept. 2000) pp 167-70
133. Vaesen K, Carchon G, Brebels S, De Raedt W and Beyne E 2001 RF multi-layer thin film technology with integrated passives for the realization of RF-front-end systems Proc. IMAPS-Europe'01 (Strasbourg, France, May 2001) pp 90-4
134. Donnay S, Pieters P, Vaesen K, Diels W, Wambacq P, De Raedt W, Beyne E, Engels M and Bolsens I 2000 Chip-package codesign of a low power 5-GHz RF front end Proc. IEEE 88 1583-97
135. Vandersmissen R, van der Zanden K, Schreurs D and Borghs G 2000 Hybrid integration of thinned metamorphic HEMTs on germanium 10th European Heterostructure Technology Workshop (Ulm, Germany)
136. Kim M, Hacker J B, Mihailovich R E and DeNatale J F 2001 A dc-to-40 GHz four-bit RF MEMS true-time delay network IEEE Microw. Wirel. Compon. Lett. 11 56-8
137. Pillans B, Eshelman S, Malczewski A, Ehmke J and Goldsmith C L 1999 Ka-band RF MEMS phase shifters IEEE Microw. Guid. Wave Lett. 9 520-2
138. Hayden J S and Rebeiz G M 2000 2-bit MEMS distributed X-band phase shifters IEEE Microw. Guid. Wave Lett. 10 540-2
139. Borgioli A, Liu Y, Nagra A S and York R A 2000 Low-loss distributed MEMS phase shifter IEEE Microw. Guid. Wave Lett. 10 7-9
140. Park J-H, Kim H-T, Kang K, Kwon Y and Kim Y-K 2001 A micromachined millimeter wave phase shifter using semi-lumped elements Transducers'01-Eurosensors XV (Munich, Germany, 10-14 June 2001) pp 1552-55
141. Grenier K, Barber B P, Lubecke V, Zierdt M, Safar H, Pons P and Gammel P L 2001 Integrated RF MEMS for single chip radio Transducers'01 - EUROSENSORS XV (Munich, Germany, 10-14 June 2001) pp 1528-31
142. McNamara D 2000 FBAR technology shrinks CDMA handset duplexers Microwaves&RF pp 71-9
143. Webpage http://www.discera.com