Wafer-level heterogeneous 3D integration for MEMS and NEMS

Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Volumn , Issue , 2012, Pages 247-252

  Niklaus, Frank ^a   Lapisa, Martin ^a   Bleiker, Simon J ^a   Dubois, Valentin ^a   Roxhed, Niclas ^a   Fischer, Andreas C ^a   Forsberg, Fredrik ^a   Stemme, Göran ^a   Grogg, Daniel ^b   Despont, Michel ^b  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b IBM RESEARCH ZURICH   (Switzerland)

Author keywords

MEMS; microelectromechanical system; More than Moore; nano electromechanical system; NEMS; self assembly; transfer printing; wafer level heterogeneous integration

Indexed keywords

3-D INTEGRATION; HETEROGENEOUS INTEGRATION; MORE-THAN-MOORE; NANO ELECTROMECHANICAL SYSTEMS; NEMS DEVICES; TRANSFER PRINTING; WAFER LEVEL;

INTEGRATION; MEMS; NEMS; SELF ASSEMBLY; TEMPERATURE;

THREE DIMENSIONAL;

EID: 84864852130     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/LTB-3D.2012.6238096     Document Type: Conference Paper

References (31)

1. M. Lapisa, G. Stemme F. Niklaus, "Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS", IEEE Journal of Selected Topics in Quantum Electronics, Vol.17, No.3, pp.629-644, 2011.
2. S. Nasiri, "New innovations in MEMS fabrications are responsible for meeting the demand for low-cost inertial sensors for consumer markets", White Paper, www.invensense.com.
3. MEMS Process Review Report, "InvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor", MPR-0702-801, Chipworks, 2007.
4. C.M. Liu, et al., "MEMS technology development and manufacturing in a CMOS foundry", IEEE Proc. Transducres 2011, pp.807-810, Beijing, China.
5. F. Niklaus, et al., "A Method to Maintain Wafer Alignment Precision During Adhesive Wafer Bonding", Sensors & Actuators A, Vol.107, No.3, pp.273-278, 2003.
6. J. Bryzek, et al., "Very Large Scale Integration of MOEMS Mirrors, MEMS Angular Amplifiers and High-Voltage, High-Density IC Electronics for Photonic Switching", Nanotech, Vol.2, pp.428-431, 2003.
7. M. Despont, et al., "Wafer-Scale Microdevice Transfer/Interconnect: its Application in an AFM-Based Data-Storage System", Journal of Microelectromechanical Systems, Vol.13, No.6, pp.895-901, 2004.
8. F. Niklaus, et al., "Characterization of transfer-bonded silicon bolometer arrays", Proc. SPIE 2004, Vol.5406, pp.521-530, Orlando, USA.
9. F. Niklaus, et al., "Performance Model for Uncooled Infrared Bolometer Arrays and Performance Predictions of Bolometers Operating at Atmospheric Pressure", Infrared Physics and Technology, Vol.51, No.3, pp.168-177, 2008.
10. C. Vieider, et al., "Low-Cost Far Infrared Bolometer Camera for Automotive Use", Proc. SPIE 2007, Vol.6542, pp.1L.1-1L.10, Orlando, USA.
11. F. Niklaus, et al., "Uncooled Infrared Bolometer Arrays Operating in a Low to Medium Vacuum Atmosphere: Performance Model and Tradeoffs", Proc. SPIE 2007, Vol.6542, pp.1M.1-1M.12, Orlando, USA.
12. F. Niklaus, C. Vieider, H. Jakobsen, "MEMS-Based Uncooled Infrared Bolometer Arrays-A Review", Proc. SPIE 2007, Vol. 6836, pp.0D1-0D15, Beijing, China.
13. P. Ericsson, et al., "Toward 17 μm Pitch Heterogeneously Integrated Si/SiGe Quantum Well Bolometer Focal Plane Arrays", Proc. SPIE 2011, Vol.8012, Orlando, USA.
14. F. Niklaus, et al., "Wafer Bonding with Nano-Imprint Resists as Sacrificial Adhesive for Fabrication of Silicon-On-Integrated-Circuit (SOIC) Wafers in 3D Integration of MEMS and ICs", Sensors and Actuators A: Physical, Vol.154, pp.180-186, 2009.
15. F. Niklaus, S. Haasl, G. Stemme, "Arrays of Monocrystalline Silicon Micromirrors Fabricated Using CMOS Compatible Transfer Bonding", IEEE Journal of Microelectromechanical Systems, Vol.12, No.4, pp.465-469, 2003.
16. F. Zimmer, et al., "One-Megapixel Monocrystalline-Silicon Micromirror Array on CMOS Driving Electronics Manufactured With Very Large-Scale Heterogeneous Integration", IEEE Journal of Microelectromechanical Systems, Vol.20, No.3, pp.564-572, 2011.
17. M.A. Lapisa, et al., "Drift-Free Micromirror Arrays Made of Monocrystalline Silicon for Adaptive Optics Applications", IEEE Journal of Microelectromechanical Systems, in print, 2012.
18. M.A. Lapisa, et al., "Hidden-Hinge Micro-Mirror Arrays Made by Heterogeneous Integration of Two Mono-Crystalline Silicon Layers", Proc. IEEE MEMS 2011, pp.696-699, Cancun, Mexico.
19. G. Schelcher, et al., "Modeling and characterization of micropirani vacuum gauges manufactured by a low-Temperature film transfer process", Journal of Microelectromechanical Systems, Vol20, No.5, pp.1184-1191, 2011.
20. T. Matsumura, et al., "Multi-Band Radio-Frequency Filters Fabricated Using Polyimide-Based Membrane Transfer Bonding Technology", Journal of Micromechanics and Microengineering, Vol.20, No.9, 095027, 2010.
21. F. Niklaus, et al., "Adhesive wafer bonding", Journal of Applied Physics, Vol.99, No.1, pp.031101.1-031101.28, 2006.
22. R. Guerre, et al., "Low-cost AFM cantilever manufacturing technology", Journal of Micromechanics and Microengineering, Vol.18, pp.115013, 2008.
23. R. Guerre et al., "Wafer-level transfer technologies for PZT-based RF MEMS switches", Journal of Microelectromechanical Systems, Vol.19, No.3, pp.548-560, 2010.
24. R. Guerre et al., "Selective transfer technology for microdevice distribution", Journal of Microelectromechanical Systems, Vol.17, No.1, pp.157-165, 2008.
25. T. Grund et al., "Transfer bonding technology for batch fabrication of SMA microactuators", The European Physical Journal-Special Topics, Vol.158, No.1, pp.237-242, 2008.
26. D. Liang, et al., "Hybrid Integrated Platforms for Silicon Photonics", Materials, Vol.3, pp.1782-1802, 2010.
27. L. Jian, H. Takagi, R.Maeda, "Chip to wafer temporary bonding with self-Alignment by patterned FDTS layer for size-free MEMS integration", IEEE Proc. Sensors 2011, pp.1121-1124, Limerick, Ireland.
28. F. Forsberg, et al., "Heterogeneous Integration Technology for Combination of Different Wafer Sizes Using an Expandable Handle Substrate", Proc. IEEE MEMS 2011, pp.268-271, Cancun, Mexico.
29. A. Javey, et al., "Layer-by-layer assembly of nanowires for threedimensional, multifunctional electronics", Nano Letters, Vol.7, No.3, pp.773-777, 2007.
30. J. Yoon, et al., "GaAs photovoltaics and optoelectronics using releasable multilayer epitaxial assemblies", Nature, Vol.465, pp.329-333, 2010.
31. X.L. Liang, et al., "Toward Clean and Crackless Transfer of Graphene", ACS Nano, Vol.5, No.11, pp.9144-9153, 2011.