One-megapixel monocrystalline-silicon micromirror array on CMOS driving electronics manufactured with very large-scale heterogeneous integration

Journal of Microelectromechanical Systems

Volumn 20, Issue 3, 2011, Pages 564-572

  Zimmer, Fabian ^a   Lapisa, Martin ^b   Bakke, Thor ^a,c   Bring, Martin ^a   Stemme, Gran ^b   Niklaus, Frank ^b  

^a FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS   (Germany)

^b ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^c SINTEF   (Norway)

Author keywords

Complementary metaloxidesemiconductor (CMOS) integrated circuits; heterogeneous integration; mirrors; photolithography; silicon; spatial light modulators (SLMs); very large scale integration; wafer bonding; wafer scale integration

Indexed keywords

COMPLEMENTARY METALOXIDESEMICONDUCTOR (CMOS) INTEGRATED CIRCUITS; HETEROGENEOUS INTEGRATION; SPATIAL LIGHT MODULATORS; VERY LARGE-SCALE INTEGRATION; WAFER-SCALE INTEGRATION;

LIGHT MODULATORS; MECHANICAL PROPERTIES; MONOCRYSTALLINE SILICON; PHOTOLITHOGRAPHY; PULSE CIRCUITS; SILICON WAFERS; SURFACE PROPERTIES; SURFACE ROUGHNESS; SURFACES; WAFER BONDING;

INTEGRATION;

EID: 79957993226     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2011.2127454     Document Type: Article

References (41)

1. P. F. Van Kessel, L. J. Hornbeck, R. E. Meier, and M. R. Douglass. (1998, Aug.). A MEMS-based projection display. Proc. IEEE. [Online]. 86(8), pp. 1687-1704. Available: http://dx.doi.org/10.1109/5.704274 (Pubitemid 128720272)
2. J. Dakin. (1996). 'Spatial light modulator technology,' edited by Uzi Efron (Marcel Dekker Inc., New York, U.S.A., September 1994, 680 pp. (hardback) illustrated ISBN 0-8247-9108-8, (no. 47 in series: 'Materials, devices and applications: Optical engineering series')).
3. Prog. Quantum Electron. [Online]. 20(1), p. 84. Available: http://dx.doi.org/10.1016/ S0079-6727(96)90009-9
4. A. M. Weiner. (2000, May). Femtosecond pulse shaping using spatial light modulators. Rev. Sci. Instrum. [Online]. 71(5), pp. 1929-1960. Available: http://dx.doi.org/10.1063/1.1150614
5. M. Hacker, G. Stobrawa, R. Sauerbrey, T. Buckup, M. Motzkus, M. Wildenhain, and A. Gehner. (2003, Jun.). Micromirror SLM for femtosecond pulse shaping in the ultraviolet. Appl. Phys. B: Lasers Opt. [Online]. 76(6), pp. 711-714. Available: http://dx.doi.org/10.1007/ s00340-003-1180-0
6. V. A. Aksyuk, F. Pardo, C. A. Bolle, S. Arney, C. R. Giles, and D. J. Bishop. (2000, Aug.). Lucent microstar micromirror array technology for large optical crossconnects. Proc. SPIE. [Online]. 4178, pp. 320-324. Available: http://adsabs.harvard.edu/cgi-bin/nph-bib-query?bibcode=2000SPIE.4178.320A
7. H. K. Lakner, P. Duerr, U. Dauderstaedt, W. Doleschal, and J. Amelung. (2001, Oct.). Design and fabrication of micromirror arrays for UV lithography. Proc. SPIE. [Online]. 4561, pp. 255-264. Available: http://adsabs.harvard.edu/ cgi-bin/nph-bib-query?bibcode= 2001SPIE.4561.255L (Pubitemid 35187464)
8. H. Takeuchi, A. Wung, X. Sun, R. T. Howe, and T. J. King. (2005, Sep.). Thermal budget limits of quarter-micrometer foundry CMOS for postprocessing MEMS devices. IEEE Trans. Electron Devices. [Online]. 52(9), pp. 2081-2086. Available: http://dx.doi.org/10.1109/TED.2005.854287 (Pubitemid 41417603)
9. H. Martinsson and T. Sandstrom. (2005). Gray scaling in highperformance mask making. Proc. SPIE. [Online]. 5853(1), pp. 1031-1042. Available: http://dx.doi.org/10.1117/12.617527 (Pubitemid 41744639)
10. H.-J. Lee, G. Cornella, and J. C. Bravman. (2000, Jun.). Stress relaxation of free-standing aluminum beams for microelectromechanical systems applications. Appl. Phys. Lett. [Online]. 76(23), pp. 3415-3417. Available: http://dx.doi.org/10.1063/1.126664
11. A. J. Kalkman, A. H. Verbruggen, and G. C. A. M. Janssen. (2001, Apr.). Young's modulus measurements and grain boundary sliding in freestanding thin metal films. Appl. Phys. Lett. [Online]. 78(18), pp. 2673-2675. Available: http://dx.doi.org/10.1063/1.1367896 (Pubitemid 33611408)
12. T. Sandner, J. U. Schmidt, H. Schenk, H. Lakner, A. Gatto, M. Yang, N. Kaiser, S. Braun, T. Foltyn, and A. Leson. (2005). Highly reflective coatings for micromechanical mirror arrays operating in the DUV and VUV spectral range. Proc. SPIE. [Online]. 5721(1), pp. 72-80. Available: http://dx.doi.org/10.1117/ 12.590522 (Pubitemid 40954570)
13. P. Durr, U. Dauderstadt, D. Kunze, M. Auvert, and H. Lakner, "Reliability test and failure analysis of optical MEMS," in Proc. 9th Int. Symp. Phys. Failure Anal. Integr. Circuits (Cat. No. 02TH8614), 2002, pp. 201-206.
14. U. Dauderstädt, P. Askebjer, P. Björnängen, P. Dürr, M. Friedrichs, M. List, D. Rudloff, J. U. Schmidt, M. Müller, and M. Wagner. (2009). Advances in SLM development for microlithography. Proc. SPIE. [Online]. 7208(1), p. 720 804. Available: http://dx.doi.org/10.1117/12.810787
15. U. A. Dauderstadt, P. Duerr, U. B. Ljungblad, T. Karlin, H. Schenk, and H. Lakner. (2005). Mechanical stability of spatial light modulators in microlithography. Proc. SPIE. [Online]. 5721(1), pp. 64-71. Available: http://dx.doi.org/10.1117/12.590082 (Pubitemid 40954569)
16. J. Z. Luberek, A. M. Carroll, T. Sandstrom, and A. Karawajczyk. (2002). Controlling CD variations in a massively parallel pattern generator. Proc. SPIE. [Online]. 4691(1), pp. 671-678. Available: http://dx.doi.org/10.1117/12.474615 (Pubitemid 35298890)
17. A. Witvrouw, L. Haspeslagh, O. Varela Pedreira, J. De Coster, I. De Wolf, H. A. C. Tilmans, T. Bearda, B. Schlatmann, M. Van Bommel, M.-C. De Nooijer, P. H. C. Magnee, E. J. Lous, M. Hagting, J. Lauria, R. Vanneer, and B. Van Drieenhuizen. (2010, Feb.). 11-megapixel CMOS-integrated SiGe micromirror arrays for high-end applications. J. Microelectromech. Syst. [Online]. 19(1), pp. 202-214. Available: http://dx.doi.org/10.1109/JMEMS.2009.2036271
18. J. Bryzek, S. Nasiri, A. Flannery, H. Kwon, M. Novack, D. Marx, E. Sigari, E. Chen, and J. Garate, "Very large-scale integration ofMOEMS mirrors, MEMS angular amplifiers and high-voltage high-density IC electronics for photonics switching," in Proc. Nanotech, 2003, vol. 1, pp. 300-303.
19. S. Nasiri, "Wafer-level packaging of MOEMS solves manufacturability challenges in optical cross connect," presented at the Photonic Devices Systems Packaging Symp., San Francisco, CA, 2003.
20. S. Nasiri, "New innovations in MEMS fabrications are responsible for meeting the demand for low-cost inertial sensors for consumer market," in Proc. Int. Symp. Microelectron., 2007.
21. J. Bryzek, A. Flannery, and D. Skurnik. (2004, Jun.). Integrating microelectromechanical systems with integrated circuits. IEEE Instrum. Meas. Mag. [Online]. 7(2), pp. 51-59. Available: http://dx.doi.org/10.1109/ MIM.2004.1304566
22. M. Despont, U. Drechsler, R. Yu, H. B. Pogge, and P. Vettiger. (2004, Dec.). Wafer-scale microdevice transfer/interconnect: Its application in an AFM-based data-storage system. J. Microelectromech. Syst. [Online]. 13(6), pp. 895-901. Available: http://dx.doi.org/10.1109/ JMEMS.2004.835769 (Pubitemid 40009490)
23. L. Dellmann, U. Drechsler, T. Morf, H. Rothuizen, R. Stutz, J. Weiss, and M. Despont. (2010, May). 3-D optoelectrical device stacking on CMOS. Microelectron. Eng. [Online]. 87(5-8), pp. 1210-1212. Available: http://dx.doi.org/10.1016/j.mee.2009.11.170
24. M. A. Michalicek and V. M. Bright. (2002, Jan.). Flip-chip fabrication of advanced micromirror arrays. Sens. Actuators A: Phys. [Online]. 95(2/3), pp. 152-167. Available: http://dx.doi.org/10.1016/S0924-4247(01)00726-9
25. I. W. Jung, U. Krishnamoorthy, and O. Solgaard. (2006, Jun.). High fill-factor two-axis gimbaled tip-tilt-piston micromirror array actuated by self-aligned vertical electrostatic comb drives. J. Microelectromech. Syst. [Online]. 15(3), pp. 563-571. Available: http://dx.doi.org/10.1109/ JMEMS.2006.876666 (Pubitemid 43895743)
26. I. W. Jung, Y.-A. Peter, E. Carr, J.-S. Wang, and O. Solgaard. (2007, Mar./Apr.). Single-crystal-silicon continuous membrane deformable mirror array for adaptive optics in space-based telescopes. IEEE J. Sel. Topics Quantum Electron. [Online]. 13(2), pp. 162-167. Available: http://dx.doi.org/10.1109/ JSTQE.2007.893560 (Pubitemid 46652352)
27. E.-H. Yang and D. V. Wiberg. (2003, Dec.). A wafer-scale membrane transfer process for the fabrication of optical-quality large continuous membranes. J. Microelectromech. Syst. [Online]. 12(6), pp. 804-815. Available: http://dx.doi.org/10.1109/JMEMS.2003.818454
28. E. H. Yang, K. Shcheglov, and S. T. McKinstry. (2003). Concept, modeling, and fabrication techniques for large-stroke piezoelectric unimorph deformable mirrors. Proc. SPIE. [Online]. 4983(1), pp. 271-278. Available: http://dx.doi.org/10.1117/12.473715
29. M. Lapisa, G. Stemme, and F. Niklaus, "Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS," IEEE J. Sel. Topics Quantum Electron. [Online]. Available: http://ieeexplore.ieee.org, DOI: 10.1109/JSTQE.2010.2093570.
30. T. Bakke, B. Völker, D. Rudloff, M. Friedrichs, H. Schenk, and H. Lakner. (2006). Large-scale drift-free monocrystalline silicon micromirror arrays made by wafer bonding. Proc. SPIE. [Online]. 6114(1), p. 611 402. Available: http://scitation.aip.org/getabs/servlet/ GetabsServlet?prog= normal&id=PSISDG006114000001611402000001 &idtype=cvips&gifs=yes
31. E. K. Baumert, P. O. Theillet, and O. N. Pierron. (2010, May). Investigation of the low-cycle fatigue mechanism for micron-scale monocrystalline silicon films. Acta Mater. [Online]. 58(8), pp. 2854-2863. Available: http://dx.doi.org/10.1016/j.actamat.2010.01.011
32. O. N. Pierron and C. L. Muhlstein. (2006, Feb.). The critical role of environment in fatigue damage accumulation in deep-reactive ion-etched single-crystal silicon structural films. J. Microelectromech. Syst. [Online]. 15(1), pp. 111-119. Available: http://dx.doi.org/10.1109/ JMEMS.2005.863602 (Pubitemid 43210795)
33. T. Bakke, B. Volker, M. Friedrichs, and D. Rudloff., "Micromirror array of monocrystalline silicon," in Proc. IEEE/LEOS Int. Conf. Opt. MEMS Their Appl. Conf., 2006, pp. 128-129. (Pubitemid 351471309)
34. F. Niklaus, S. Haasl, and G. Stemme. (2003, Aug.). Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding. J. Microelectromech. Syst. [Online]. 12(4), pp. 465-469. Available: http://dx.doi.org/10.1109/JMEMS.2003.815833
35. M. Lapisa, F. Zimmer, F. Niklaus, A. Gehner, and G. Stemme, "CMOSintegrable piston-type micromirror array for adaptive optics made of monocrystalline silicon using 3-D integration," in Proc. IEEE 22nd Int. Conf. Micro Electro Mech. Syst., Jan. 2009, pp. 1007-1010.
36. F. Zimmer, M. Lapisa, T. Bakke, M. Bring, G. Stemme, and F. Niklaus, "Very large-scale heterogeneous system integration for 1-megapixel monocrystalline silicon micromirror array on CMOS driving electronics," in Proc. MEMS, 2011, pp. 736-739.
37. F. Niklaus, A. Decharat, F. Forsberg, N. Roxhed, M. Lapisa, M. Populin, F. Zimmer, J. Lemm, and G. Stemme, "Wafer bonding with nanoimprint resists as sacrificial adhesive for fabrication of silicon-onintegrated-circuit (SOIC) wafers in 3-D integration of MEMS and ICs," Sens. Actuators A, Phys., vol. 154, no. 1, pp. 180-186, Aug. 2009.
38. T. Bakke, J. Schmidt, M. Friedrichs, and B. Völker, "Etch stop materials for release by vapor HF etching," in Proc. MicroMechanics Eur. Workshop, 2005, vol. 16, pp. 103-106.
39. H. Lakner, P. Dürr, U. Dauderstädt, W. Doleschal, and J. Amelung, "Design and fabrication of micromirror arrays for UV lithography," Proc. SPIE, vol. 4561, pp. 255-264, 2001. (Pubitemid 35187464)
40. X. Ding, W. H. Ko, and J. M. Mansour. (1990, Apr.). Residual stress and mechanical properties of boron-doped p+-silicon films. Sens. Actuators A: Phys. [Online]. 23(1-3), pp. 866-871. Available: http://dx.doi.org/10.1016/0924- 4247(90)87048-N (Pubitemid 20699640)
41. H. A. Rueda and M. E. Law, "Modeling of strain in boron-doped silicon cantilevers," in Proc. Int. Conf. Model. Simul. Microsyst., 1998, pp. 94-99.