SOP: What is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 2, 2004, Pages 241-249

  Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; CONSUMER ELECTRONICS; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED OPTOELECTRONICS; MULTICHIP MODULES; OPTICAL INTERCONNECTS; PRINTED CIRCUIT BOARDS; RELIABILITY; STRESS ANALYSIS; THERMAL EXPANSION; THIN FILM CIRCUITS;

CONVERGENT ELECTRONICS SYSTEMS; INTEGRATED CIRCUIT PACKAGING; MOORE LAW; SYSTEM-IN-PACKAGE; SYSTEM-ON-CHIP; SYSTEM-ON-PACKAGE;

CHIP SCALE PACKAGES;

EID: 4544359901     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.830354     Document Type: Article

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